System and method for producing particles and patterned films
Abstract
A system including a mold having a fluoropolymer wherein the mold defines a plurality of cavities having a predetermined shape and a cross-sectional dimension less than about 100 micrometers; a roller; a surface in cooperation with the roller to form a nip point configured to receive the mold, wherein the nip point is further configured to receive a substantially liquid composition and accelerate entry of the substantially liquid composition into the cavity. A method of forming particles including applying a substantially liquid composition to a mold, wherein the mold comprises a fluoropolymer and defines a plurality of cavities each having a broadest cross-sectional dimension of less than about 100 micrometers; nipping the mold between a roller and a surface such that the substantially liquid composition enters the cavities of the mold; and hardening the substantially liquid composition in the cavities of the mold to form a particle within each cavity, wherein the particle has a size and shape that substantially mimics the size and shape of the cavity of the mold.
Claims
exact text as granted — not AI-modified1 - 10 . (canceled)
11 . A particle system, comprising:
a mold defining a plurality of cavities configured to receive a substance to be molded, wherein each cavity of the mold has a shape, a size, and an opening; a substrate configured to mate with the mold to close the openings in the plurality of cavities; an engagement apparatus configured to receive and pass the substrate and the mold through a pressure point, wherein the engagement apparatus is movably configured to provide the pressure point; a force generating apparatus in communication with the engagement apparatus and configured to generate a force to create pressure at the pressure point of the engagement apparatus; a controller in communication with the force generating apparatus and configured to instruct the force generating apparatus to generate a selected amount of force; and a substance positioned between the substrate and the mold such that the substance enters the plurality of cavities of the mold when the mold and substrate pass through the pressure point of the engagement apparatus.
12 . The particle system of claim 11 , wherein the engagement apparatus further comprises a roller configured to receive and pass the substrate and the mold through the engagement apparatus.
13 . The particle system of claim 12 , wherein the roller is passive or driven.
14 . The particle system of claim 11 , wherein the force generating apparatus further comprises a piston configured to generate and apply the force to the engagement apparatus and form the pressure point.
15 . The particle system of claim 11 , wherein the pressure point of the engagement apparatus is configured to apply the force from the force generating apparatus to the substrate and mold positioned within the pressure point of the engagement apparatus.
16 . The particle system of claim 11 , wherein the substance is configured to harden within the cavities of the mold and form particles.
17 . The particle system of claim 16 , wherein the particles are configured and dimensioned to substantially mimic the shape and size of the cavities of the mold.
18 . The particle system of claim 11 , wherein the substance is a substantially liquid composition comprising a pharmaceutical or a therapeutic agent.
19 . A system comprising:
a substrate configured to receive a plurality of particles; an array of particles, wherein at least one surface of each particle is coupled with the substrate; an engagement apparatus configured to receive and pass the array of particles coupled with the substrate through a pressure point, wherein the engagement apparatus is moveably configured to provide the pressure point; a force generating apparatus in communication with the engagement apparatus and configured to generate a force to create pressure at the pressure point of the engagement apparatus; a controller in communication with the force generating apparatus and configured to instruct the force generating apparatus to generate a selected amount of force; a solvent deposited onto the substrate proximate the engagement apparatus, wherein the solvent is configured to disengage the particles from the substrate; and a collector configured to collect the disengaged particles.
20 . The system of claim 19 , wherein the engagement apparatus further comprises a roller configured to receive and pass the array of particles coupled with the substrate through the engagement apparatus.
21 . The system of claim 19 , further comprising a soluble substance in communication with the substrate configured to receive the array of particles.
22 . The system of claim 21 , wherein the array of particles are removeably coupled with the soluble substance.
23 . The system of claim 21 , wherein the solvent is configured to dissolve the soluble sub stance.
24 . The system of claim 20 , wherein the roller comprises an elastic material or an elastic hydrocarbon polymer.
25 . The system of claim 20 , wherein the roller is driven or passive.
26 . The system of claim 19 , further comprising air jets configured to provide an air stream to contain the solvent proximate the engagement apparatus.
27 . The system of claim 26 , wherein the controller is configured to control the air stream provided by the air jets.
28 . The system of claim 19 , wherein the controller is configured to control the deposition of the solvent.
29 . The system of claim 19 , wherein the controller is configured to control the collector.
30 . A particle fabrication and harvesting system, comprising:
a mold defining a plurality of cavities configured to receive a substance to be molded, wherein each cavity of the mold has a shape, a size, and an opening; an engagement apparatus configured to receive and pass the mold through a pressure point, wherein the engagement apparatus is movably configured to provide the pressure point; a substance positioned on the mold such that the substance enters the cavities of the mold when the mold passes through the pressure point of the engagement apparatus and forms particles in the cavities of the mold; a substrate having a surface substantially coated with a dissolvable coating configured to receive the particles; a solvent system configured to deposit solvent onto the substrate, wherein the solvent is configured to disengage the particles from the substrate; and a collector configured to collect the disengaged particles.Cited by (0)
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