Sam assisted selective e-less plating on packaging materials

Abstract

A method including activating an area of a polymer layer on a substrate with electromagnetic radiation; modifying the activated area; forming a self-assembled monolayer on the modified active area; reacting the self-assembled monolayer with the self-assembled monolayer; and reacting the self-assembled monolayer with a conductive material. A method including activating an area of a polymer dielectric layer on a substrate with electromagnetic radiation, the area selected for an electrically conductive line; modifying the activated area; forming a self-assembled monolayer on the modified active area; reacting the self-assembled monolayer with a catalyst; and electroless plating a conductive material on the self-assembled monolayer.

What is claimed is: 
     
         1 . A method comprising:
 activating an area of a polymer layer on a substrate with electromagnetic radiation;   modifying the activated area;   forming a self-assembled monolayer on the modified active area;   reacting the self-assembled monolayer with the self-assembled monolayer; and   reacting the self-assembled monolayer with a conductive material.   
     
     
         2 . The method of  claim 1 , wherein modifying the activated area comprises forming a hydroxyl ion rich area. 
     
     
         3 . The method of  claim 1 , wherein the self-assembled monolayer comprises a functional group operable to react with the catalyst. 
     
     
         4 . The method of  claim 3 , wherein the functional group comprises one of an amine moiety, a sulfhydryl moiety and a pyridil moiety. 
     
     
         5 . The method of  claim 1 , wherein prior to reacting the self-assembled monolayer with a conductive material, the method comprises reacting the self-assembled monolayer with a catalyst. 
     
     
         6 . The method of  claim 5 , wherein the catalyst is a metal and reacting the self-assembled monolayer with a conductive material comprises reducing the catalyst in a bath comprising a reducing agent and the conductive material. 
     
     
         7 . The method of  claim 6 , wherein the bath comprises the conductive material in an oxidized state and the reducing agent reacting the self-assembled monolayer with a conductive material comprises reducing the state of the conductive material. 
     
     
         8 . The method of  claim 1 , wherein the substrate comprises a package substrate. 
     
     
         9 . A method comprising:
 activating an area of a polymer dielectric layer on a substrate with electromagnetic radiation, the area selected for an electrically conductive line;   modifying the activated area;   forming a self-assembled monolayer on the modified active area;   reacting the self-assembled monolayer with a catalyst; and   electroless plating a conductive material on the self-assembled monolayer.   
     
     
         10 . The method of  claim 9 , wherein modifying the activated area comprises forming a hydroxyl ion rich area. 
     
     
         11 . The method of  claim 9 , wherein the self-assembled monolayer comprises a functional group operable to react with the catalyst. 
     
     
         12 . The method of  claim 11 , wherein the functional group comprises one of an amine moiety, a sulfhydryl moiety and a pyridil moiety. 
     
     
         13 . The method of  claim 9 , wherein the catalyst comprises palladium. 
     
     
         14 . The method of  claim 9 , wherein electroless plating a conductive material comprises reducing the catalyst in a bath comprising a reducing agent that is oxidized. 
     
     
         15 . The method of  claim 14 , wherein the bath comprises the conductive material in an oxidized state and electroless plating a conductive material comprises reducing the state of the conductive material. 
     
     
         16 . The method of  claim 9 , wherein the substrate comprises a package substrate. 
     
     
         17 . A substrate comprising a plurality of conductive lines formed on dielectric material, the conductive lines formed of conductive material chemically bonded to the dielectric material through a self-assembled monolayer. 
     
     
         18 . The substrate of  claim 17 , wherein the conductive material is chemically bonded to the self-assembled monolayer through a catalyst. 
     
     
         19 . The substrate of  claim 17 , wherein the dielectric material comprises a polymer material. 
     
     
         20 . The substrate of  claim 17 , wherein the substrate is a package substrate.