Acoustic wave device and method for producing same

Abstract

An acoustic wave device comprises a substrate and an acoustic wave element on one main surface of the substrate. Side surfaces of the substrate comprises a protruding portion which protrudes out at a side of an another main surface closer than a side with the one main surface side.

1 . An acoustic wave device, comprising:
 a substrate and   an acoustic wave element on one main surface of the substrate, wherein   a side surface of the substrate comprises a protruding portion which protrudes out at a side of an another main surface closer than a side of the one main surface.   
     
     
         2 . The acoustic wave device according to  claim 1 , wherein
 when the side surface of the substrate are divided in a thickness direction into two regions of a first region at the side of the one main surface and a second region at the side of the another main surface, the protruding portion is provided in the second region.   
     
     
         3 . The acoustic wave device according to  claim 2 , wherein
 the protruding portion is provided along an outer circumference of the other main surface and over the entire outer circumference.   
     
     
         4 . The acoustic wave device according to  claim 1 , wherein
 the protruding portion is formed tapered to spread more outward toward a position near the other main surface.   
     
     
         5 . The acoustic wave device according to  claim 1 , further comprising:
 a resin film which covers the side surface of the substrate at the part at the side of the one main surface other than the protruding portion, abuts against the protruding portion from the side of the one main surface, and is softer than the substrate.   
     
     
         6 . The acoustic wave device according to  claim 5 , further comprising:
 a cover which is provided on the one main surface and seals the acoustic wave element, wherein   a side surface of the cover which is located at an inner side away from the side surface of the substrate and which forms a step with the substrate, and   the resin film is provided and straddles the side surface of the cover from the side surface of the substrate and abuts against the step from the side of the one main surface.   
     
     
         7 . The acoustic wave device according to  claim 1 , wherein:
 the side surface of the substrate at the side of the one main surface other than the protruding portion and the surface of the protruding portion facing the side direction of the substrate are cut surfaces formed by surfaces cut by a blade.   
     
     
         8 . A method for manufacturing an acoustic wave device, comprising:
 a first cutting step of forming a groove portions which partition a plurality of acoustic wave devices by cutting with a first blade one main surface side portion of a wafer which the plurality of acoustic wave elements are provided on one main surface and   a second cutting step of cutting an other main surface side portion of the wafer along the groove portions with a second blade having a thinner blade thickness than the first blade, and separating the wafer.   
     
     
         9 . The method for manufacturing an acoustic wave device according to  claim 8 , further comprising:
 a step of filling resin in the groove portions after the first cutting step and before the second cutting step.   
     
     
         10 . The method for manufacturing an acoustic wave device according to  claim 8 , further comprising:
 a step of forming a resin layer on the other main surface of the wafer before the first cutting step, wherein   the resin layer is not cut in the first cutting step, and   the resin layer is cut in the second cutting step.