US2017189276A1PendingUtilityA1

Method for creating a Mineral Trioxide Aggregate material with improved biological effects

Assignee: DENTSPLY SIRONA INCPriority: Apr 29, 2015Filed: Apr 28, 2016Published: Jul 6, 2017
Est. expiryApr 29, 2035(~8.8 yrs left)· nominal 20-yr term from priority
A61K 6/851A61K 6/887A61K 6/17A61K 6/76A61L 27/165A61L 2420/02C04B 2103/0067A61L 2430/12A61L 27/32A61L 2420/08C23C 14/22A61L 27/306B28B 1/14B28B 11/24C04B 2111/00836C04B 28/04A61K 6/0606C23C 14/082A61C 8/0013C23C 14/34A61C 5/50C23C 14/24A61L 27/30A61C 13/0006A61C 13/0835
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Claims

Abstract

A dental device is improved in its ability to produce hydroxyl apatite by having a layer of mineral trioxide aggregate (MTA) deposited thereon. A tile of MTA is prepared, heat treated and sintered to produce a micronized tile of MTA that can then be deposited by physical vapor depositions, hot isostatic pressing, molding or other conventional technique.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An implantable dental device comprising a layer of mineral trioxide aggregate that produces hydroxyl apatite in the presence of phosphate buffered saline. 
     
     
         2 . An implantable dental device as in  claim 1  wherein said device is an obturation point. 
     
     
         3 . An implantable device as in  claim 1  wherein said obturation point comprises gutta-percha. 
     
     
         4 . A method for producing hydroxyl apatite on a dental device comprising the step of preparing a tile of mineral trioxide aggregate. 
     
     
         5 . A method as in  claim 4  further comprising forming a mixture by mixing Portland cement and deionized water in an amount of from about 10:1 to about 1:10. 
     
     
         6 . A method as in  claim 5  wherein said mixture is placed into a mold and cured in a humidity chamber. 
     
     
         7 . A method as in  claim 6  wherein said humidity chamber is set at 36 degrees Celsius with about a 90 percent relative humidity for from about 5 hours to about 10 days. 
     
     
         8 . A method as in  claim 7  wherein said cured mixture is subjected to a second heating by heating to from about 50 to about 500 degrees Celsius for from about 15 minutes to about 2 days. 
     
     
         9 . A method as in  claim 8  wherein said method includes micronizing said cured tile. 
     
     
         10 . A method as in  claim 9  wherein said micronizing includes ball-mill grinding said tile to a particle size of from about 1 to about 200 microns. 
     
     
         11 . A method as in  claim 10  wherein said micronizing includes ball-mill grinding said tile to a particle size of from about 10 to about 100 microns. 
     
     
         12 . A method as in  claim 11  wherein said micronizing includes ball-mill grinding said tile to a particle size of about 53 microns. 
     
     
         13 . A method as in  claim 9  wherein said micronized tile is sintered at a temperature of from about 25 to about 400 degrees Celsius for a period of from about 5 minutes to about 5 hours. 
     
     
         14 . A method as in  claim 13  wherein said sintered, micronized tile is subjected to a second sintering temperature of from about 275 to about 650 degrees Celsius for from about 5 minutes to about 12 hours. 
     
     
         15 . A method as in  claim 14  wherein said second sintering step is conducted at a pressure of from about 5000 psi to about 50,000 psi. 
     
     
         16 . A method as in  claim 14  wherein said sintered, micronized tile is subjected to a third sintering temperature of from about 550 to about 1100 degrees Celsius for from about 30 minutes to about 2 days. 
     
     
         17 . A method as in  claim 16  wherein said third sintering step is conducted at a pressure of from about 1000 psi to about 50,000 psi. 
     
     
         18 . A method as in  claim 9  wherein said step of depositing includes physical vapor deposition of said micronized tile. 
     
     
         19 . A method as in  claim 9  wherein said step of depositing includes hot isostatic pressing of said micronized tile. 
     
     
         20 . A method as in  claim 9  wherein said step of depositing includes hot isostatic pressing of said micronized tile. 
     
     
         21 . A method as in  claim 9  wherein said step of depositing includes molding of said micronized tile.

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