Electrical connection element
Abstract
Electrical connection element containing a copper-zinc alloy. The copper-zinc alloy comprises (in percent by weight): 28.0 to 36.0% Zn, 0.5 to 1.5% Si, 1.5 to 2.5% Mn, 0.2 to 1.0% Ni, 0.5 to 1.5% Al, 0.1 to 1.0% Fe, optionally also up to a maximum of 0.1% Pb, optionally also up to a maximum of 0.1% P, optionally up to a maximum of 0.08% S, the remainder being Cu and inevitable impurities. According to the invention, mixed silicides containing iron, nickel and manganese are incorporated in the matrix. The structure comprises an α-matrix, which contains inclusions of β-phase from 5 up to 45 percent by volume and of mixed silicides containing iron, nickel and manganese up to 20 percent by volume. The structure further comprises mixed silicides containing iron, nickel and manganese having a stemmed shape and iron and nickel enriched mixed silicides having a globular shape.
Claims
exact text as granted — not AI-modified1 . An electrical connection element containing a copper-zinc alloy consisting of (in % by weight):
from 28.0 to 36.0% of Zn, from 0.5 to 1.5% of Si, from 1.5 to 2.5% of Mn, from 0.2 to 1.0% of Ni, from 0.5 to 1.5% of Al, from 0.1 to 1.0% of Fe, optionally up to not more than 0.1% of Pb, optionally up to not more than 0.1% of P, optionally up to 0.08% of S, balance Cu and unavoidable impurities, characterized
in that iron-nickel-manganese-containing mixed silicides are embedded in the matrix,
in that the microstructure consists of an α matrix in which inclusions of β phase in a proportion of from 5 to 45% by volume and of iron-nickel-manganese-containing mixed silicides in a proportion of up to 20% by volume are present,
in that the iron-nickel-manganese-containing mixed silicides having a rod-like form and iron-nickel-enriched mixed silicides having a globular shape are present in the microstructure.
2 . The electrical connection element as claimed in claim 1 , characterized by:
from 30.0 to 36.0% of Zn, from 0.6 to 1.1% of Si, from 1.5 to 2.2% of Mn, from 0.2 to 0.7% of Ni, from 0.5 to 1.0% of Al, from 0.3 to 0.5% of Fe.
3 . The electrical connection element as claimed in claim 2 , characterized by:
from 33.5 to 36.0% of Zn.
4 . The electrical connection element as claimed in claim 1 , characterized in that the electrical conductivity of the alloy is at least 5.8 MS/m.
5 . The electrical connection element as claimed in claim 4 , characterized in that the electrical conductivity of the alloy is at least 10 MS/m.
6 . The electrical connection element as claimed in claim 5 , characterized in that the electrical conductivity of the alloy is at least 13 MS/m.
7 . The electrical connection element composed of a copper-zinc alloy as claimed in claim 1 , characterized in that the microstructure consisting of an α matrix in which inclusions of β phase in a proportion of from 5 to 45% by volume and of iron-nickel-manganese-containing mixed silicides in a proportion of up to 20% by volume are present has been formed after a further treatment comprising at least one hot forming and/or cold forming step and optionally further heat treatment steps.
8 . The electrical connection element composed of a copper-zinc alloy as claimed in claim 7 , characterized in that the alloy has gone through the following steps during its further treatment:
extrusion or hot rolling in the temperature range from 600 to 800° C., at least one cold forming step.
9 . The electrical connection element composed of a copper-zinc alloy as claimed in claim 7 , characterized in that the alloy has gone through the following steps during its further treatment:
extrusion or hot rolling in the temperature range from 600 to 800° C., a combination of at least one cold forming step and at least one heat treatment in the temperature range from 250 to 700° C.
10 . The electrical connection element composed of a copper-zinc alloy as claimed in claim 8 , characterized in that, during the further treatment, the forming is followed by at least one annealing heat treatment in the temperature range from 250 to 450° C.Join the waitlist — get patent alerts
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