Method for making housing

Abstract

A method of making a housing includes: providing a metal base, the metal base having an internal surface. Placing the metal base into a mold, liquid non-conductive material covering at least a portion of the internal surface of the metal base to form a non-conductive member at the at least a portion of the metal base. Cutting the metal base corresponding to the at least a portion of the metal base to form at least one gap, the non-conductive member being formed on a bottom of the gap. Placing one dielectric member in one corresponding gap.

What is claimed is: 
     
         1 . A method of making a housing comprising:
 providing a metal base, the metal base having an internal surface;   placing the metal base into a mold, liquid non-conductive material covering at least a portion of the internal surface of the metal base to form a non-conductive member at the at least a portion of the metal base;   cutting the metal base corresponding to the at least a portion of the metal base to form at least one gap, the non-conductive member being formed on a bottom of the gap; and   placing one dielectric member in one corresponding gap.   
     
     
         2 . The method of  claim 1 , wherein the method of making the housing further comprises a step of thinning the thickness of at least a portion of the metal base by a thinning process before the forming of the non-conductive member to form a groove at the internal surface of the metal base, the non-conductive member is received in the groove. 
     
     
         3 . The method of  claim 1 , wherein the method of making the housing further includes a step of forming a protective layer on the metal base by a surface treating process after the forming the dielectric member, the dielectric layer has a thickness of 10 μm to 15 μm. 
     
     
         4 . The method of  claim 1 , wherein the dielectric member is connected with the non-conductive member. 
     
     
         5 . The method of  claim 1 , wherein each gap has a width of 0.02 mm to 0.7 mm along a direction from an adjacent dielectric member located at one side of a metal sheet to another adjacent dielectric member located at an opposite side of the metal sheet. 
     
     
         6 . The method of  claim 1 , wherein each dielectric member has a width of 0.02 mm to 0.7 mm along a direction from an adjacent non-conductive member located at one side of a metal sheet to another adjacent non-conductive member located at an opposite side of the metal sheet. 
     
     
         7 . The method of  claim 1 , wherein each metal sheet has a width of 0.15 mm to 1.0 mm along a direction from an adjacent non-conductive member located at one side of a metal sheet to another adjacent non-conductive member located at an opposite side of the metal sheet. 
     
     
         8 . The method of  claim 1 , wherein a thickness of the metal base corresponding to the groove is 0.3 mm to 0.5 mm. 
     
     
         9 . The method of  claim 1 , wherein the dielectric member is made of one of a resin, a rubber, and a ceramic. 
     
     
         10 . The method of  claim 1 , wherein the metal base is made of the material selected from a group consisting of aluminium, aluminium alloy, magnesium, magnesium alloy, titanium, titanium alloy, copper and copper alloy. 
     
     
         11 . The method of  claim 1 , wherein the non-conductive member is selected from a group consisting of polybutylene terephthalate, polyphenylene sulfide, polyethylene terephthalate, polyether ether ketone, polycarbonate, polyvinyl chloride polymer, polyurethane resin, epoxy, and polyurea resin.