US2017222095A1PendingUtilityA1

Resin molded product and manufacturing method thereof, and wavelength conversion member and illumination member

47
Assignee: NS MAT INCPriority: Aug 6, 2014Filed: Jul 31, 2015Published: Aug 3, 2017
Est. expiryAug 6, 2034(~8.1 yrs left)· nominal 20-yr term from priority
H10W 74/00C09K 11/02H01L 33/502H01L 23/057H01L 33/501H01L 33/507B29C 45/00B29C 48/00C08K 5/01C08K 5/54H10H 20/8511C08J 5/00C09K 11/025H10H 20/851C08K 5/098B32B 27/00
47
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

It is an object of the present invention to provide a resin molded product capable of increasing a degree of freedom of a shape compared to prior arts, further provided with increased durability against environmental changes and improved reliability, a manufacturing method thereof, and a wavelength conversion member and an illumination member. The present invention is implemented by molding resin in which quantum dots are dispersed. The resin preferably contains a dispersant composed of metal soap. For example, a wavelength conversion bar (fluorescent bar) ( 3 ) interposed between a light-emitting device ( 1 ) such as an LED and a light-guiding board ( 2 ) is molded using quantum-dot-containing resin of the present invention.

Claims

exact text as granted — not AI-modified
1 . A resin molded product obtained by molding resin in which quantum dots are dispersed. 
     
     
         2 . The resin molded product according to  claim 1 , wherein the resin contains a dispersant made of metal soap. 
     
     
         3 . The resin molded product according to  claim 2 , wherein the metal soap is calcium stearate. 
     
     
         4 . The resin molded product according to  claim 2 , wherein 1 ppm to 40,000 ppm of the metal soap is contained in the resin. 
     
     
         5 . The resin molded product according to  claim 1 , wherein a plurality of the quantum dots form an aggregate and the aggregates are dispersed. 
     
     
         6 . The resin molded product according to  claim 5 , wherein several hundreds or more of the aggregates are contained within a square of 500 nm. 
     
     
         7 . The resin molded product according to  claim 5 , wherein the aggregate comprises not more than several hundreds of aggregated quantum dots. 
     
     
         8 . The resin molded product according to  claim 1 , further comprising:
 a resin layer comprising the quantum dots contained in the resin; and   a coating layer that coats a surface of the resin layer.   
     
     
         9 . The resin molded product according to  claim 1 , wherein the resin contains a scattering agent. 
     
     
         10 . A wavelength conversion member comprising the resin molded product according to  claim 1 . 
     
     
         11 . An illumination member comprising the resin molded product according to  claim 1 . 
     
     
         12 . A method for manufacturing a resin molded product obtained by molding a resin composition obtained by dispersing quantum dots in resin. 
     
     
         13 . The method for manufacturing a resin molded product according to  claim 12 , wherein the resin molded product is obtained by molding the resin composition obtained by mixing the resin and metal soap with a quantum dot liquid obtained by dispersing the quantum dots in the resin. 
     
     
         14 . The method for manufacturing a resin molded product according to  claim 13 , wherein calcium stearate is used for the metal soap. 
     
     
         15 . The method for manufacturing a resin molded product according to  claim 13 , wherein organosilane or hexane is used for the solvent. 
     
     
         16 . The method for manufacturing a resin molded product according to  claim 13 , wherein a scattering agent is mixed into the quantum dot liquid. 
     
     
         17 . The method for manufacturing a resin molded product according to  claim 12 , further comprising:
 performing extrusion molding on the resin molded product to create a pellet; and   performing injection molding using the pellet.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.