Method and system for smart contact arrays

Abstract

A device includes a device body having an attachment face defined by an attachment area and a contact array disposed in the device body and exposed at a coupling face. The contact array comprises one or more magnets disposed on the coupling face and a plurality of terminals disposed on the coupling face. A periphery of the one or more magnets and the plurality of terminals defines a coupling area. The attachment area is greater than and independent of the coupling area.

1 . A device comprising:
 a device body having an attachment face defined by an attachment area lying in an attachment plane; and   a contact array disposed in the device body and exposed at a coupling face, wherein the contact array comprises:
 one or more magnets, each of the one or more magnets having a magnetic attachment face disposed on and coplanar with the coupling face; and 
 a plurality of substantially planar terminals, each of the plurality of substantially planar terminals having a contact face disposed on and coplanar with the coupling face, 
   wherein a periphery of the one or more magnets and the plurality of substantially planar terminals defines a coupling area and wherein the attachment area is greater than and independent of the coupling area.   
     
     
         2 . The device of  claim 1  wherein:
 the contact array is characterized by a bisector; 
 the one or more magnets comprises at least a pair of magnets, each magnet of the at least one pair of magnets being positioned an equal distance from the bisector; and 
 the plurality of substantially planar terminals are arrayed in pairs, each terminal of each pair being positioned an equal distance from the bisector. 
 
     
     
         3 . The device of  claim 2  wherein multiple terminals are disposed proximally to each of the at least one pair of magnets. 
     
     
         4 . The device of  claim 2  wherein a north pole of a first magnet of the at least one pair of magnets and a south pole of a second magnet of the at least one pair of magnets are on opposing sides of the bisector. 
     
     
         5 . The device of  claim 2  wherein the at least one pair of magnets comprises a plurality of pairs of magnets, the contact array is further characterized by a second bisector orthogonal to the bisector, a first pair of the plurality of pairs of magnets comprises a north pole and a second pair of the plurality of pairs of magnets comprises a south pole, the north pole and the south pole being positioned on a same side of the bisector and an equal distance from the second bisector. 
     
     
         6 . The device of  claim 2  wherein the at least one pair of magnets comprises a plurality of pairs of magnets, the contact array is further characterized by a second bisector orthogonal to the bisector, a first pair of the plurality of pairs of magnets comprises a north pole and a second pair of the plurality of pairs of magnets comprises a north pole, the north poles being positioned on a same side of the bisector and an equal distance from the second bisector. 
     
     
         7 . The device of  claim 1  wherein:
 the contact array is characterized by a first bisector and a second bisector orthogonal to the first bisector, both the first bisector and the second bisector passing through a center point; 
 the one or more magnets comprises a plurality of pairs of magnets, each magnet of the plurality of pairs of magnets having reflective symmetry with respect to at least one of the first bisector or the second bisector and opposing polarity, each magnet being arrayed a fixed radius from the center point; and 
 the plurality of substantially planar terminals are arrayed in pairs, each substantially planar terminal of each pair being positioned an equal distance from at least one of the first bisector or the second bisector. 
 
     
     
         8 . The device of  claim 1  further comprising a microcontroller chip. 
     
     
         9 . The device of  claim 8  wherein the contact array is coupled to a lead frame having a die attach region and individual leads, wherein the microcontroller chip is attached to the die attach region, each substantially planar terminal of the plurality of substantially planar terminals is attached to a corresponding individual lead, and a bond wire or interconnection element connects each of the corresponding leads to an input/output pad of the microcontroller. 
     
     
         10 . The device of  claim 1  further comprising a magnetic field containment device surrounding the one or more magnets. 
     
     
         11 . The device of  claim 1  wherein the one or more magnets is operable to serve as an electrical terminal. 
     
     
         12 . The device of  claim 1  wherein the device comprises a second coupling face opposing the coupling face and wherein:
 the one or more magnets extend through the device body and are further disposed on the second coupling face; and 
 the plurality of substantially planar terminals extend through the device body and are further disposed on the second coupling face. 
 
     
     
         13 . The device of  claim 1  wherein the device body has a backside face and a second contact array is disposed in the device body and exposed at a second coupling face, wherein the second contact array comprises one or more additional magnets disposed on the second coupling face and a plurality of second terminals disposed on the second coupling face. 
     
     
         14 . The device of  claim 1  further comprising a blade coupled to the device body, the blade comprising:
 a touch/display screen disposed on a first surface; and 
 a second contact array disposed on a second surface opposing the first surface. 
 
     
     
         15 . The device of  claim 1  further comprising one or more mechanical features protruding from the coupling face. 
     
     
         16 . A system of coupled devices comprising:
 a first device comprising a first microcontroller and a first interface element disposed in a first coupling face having a first attachment area; and   a second device comprising a second microcontroller and a second interface element disposed in a second coupling face having a second attachment area;   wherein each of the first interface element and the second interface element comprise:
 one or more magnets disposed on the respective coupling face; and 
 a plurality of terminals disposed on the respective coupling face; 
   wherein a periphery of the one or more magnets and the plurality of terminals of each device defines a coupling area and wherein the first attachment area and the second attachment area are greater than and independent of the coupling area.   
     
     
         17 . The system of  claim 16  further comprising:
 a substrate characterized by a horizontal bisector and a vertical bisector; 
 two pairs of opposing polarity magnets coupled to the substrate, each pair being disposed on opposing sides of the horizontal bisector and equidistant from the horizontal bisector, wherein each magnet of each pair is equidistant from the vertical bisector and magnets on a same side of the vertical bisector have opposing polarity;
 a plurality of terminals coupled to the substrate, each terminal having a matching terminal equidistant from the vertical bisector. 
 
 
     
     
         18 . A method for connecting electronic devices, the method comprising:
 providing a first device having a first contact array comprising a coupling force element and a plurality of terminals, the first device having a geometry independent of the first contact array;   providing a second device having a second contact array comprising a second coupling force element and a second plurality of terminals, wherein the second contact array is matched to the first contact array;   positioning the first and second devices with the first and second contact arrays in proximate alignment;   coupling the first and second devices together for operational use as a combined system; and   uncoupling the first and second devices when the operations of the combined system have been completed.   
     
     
         19 . The method of  claim 18  wherein coupling the first and second devices together comprises using a snap-on action and uncoupling the first and second devices comprises using a snap-off action. 
     
     
         20 . The method of  claim 18  wherein uncoupling the first and second devices comprises:
 holding the first device between thumb and fingers of a first hand; 
 gripping the second device between thumb and fingers of the second hand; and 
 manipulating the second device with respect to the first device until the devices are uncoupled.