Radio ic device

Abstract

A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

1 . (canceled) 
     
     
         2 . A radio IC device comprising:
 a substrate;   a radio IC including first and second input/output electrodes, the radio IC being mounted on the substrate, and arranged to process received signals and to transmit a signal; and   first and second electrodes connected to the first and second input/output electrodes of the radio IC; wherein   the substrate is attached to at least one of a metal case and a metal component;   at least one of the first and second electrodes is electromagnetically coupled to the at least one of the metal case and the metal component; and   the at least one of the metal case and the metal component functions as a radiation plate.   
     
     
         3 . The radio IC device according to  claim 2 , wherein the first and second electrodes are configured in a meandering arrangement. 
     
     
         4 . The radio IC device according to  claim 2 , wherein the radio IC is connected to a loop electrode. 
     
     
         5 . The radio IC device according to  claim 4 , wherein the loop electrode is defined by a spiral electrode. 
     
     
         6 . The radio IC device according to  claim 2 , wherein the at least one of the metal case and the metal component is disposed close to at least one of the first and second electrodes. 
     
     
         7 . The radio IC device according to  claim 2 , wherein the at least one of the metal case and the metal component overlaps at least one of the first and second electrodes. 
     
     
         8 . The radio IC device according to  claim 2 , wherein at least one of the first and second electrodes is electrically connected to a ground electrode. 
     
     
         9 . The radio IC device according to  claim 2 , wherein
 the first and second electrodes are disposed on a first main surface of the substrate, and the substrate is attached to the at least one of the metal case and the metal component at a second main surface of the substrate; and   the at least one of the first and second electrodes is electromagnetically coupled to the at least one of the metal case and the metal component through the substrate.   
     
     
         10 . The radio IC device according to  claim 2 , wherein
 the substrate is attached to a first metal element and a second metal element of the at least one of the metal case and the metal component;   the first and second electrodes are electromagnetically coupled to the first and second metal elements, respectively; and   the first and second metal elements each functions as a radiation plate.   
     
     
         11 . The radio IC device according to  claim 10 , wherein the first and second electrodes are disposed on a first main surface of the substrate, the substrate is attached to the first metal element at the first main surface of the substrate, and the substrate is attached to the second metal element at a second main surface of the substrate; and
 the second electrode is electromagnetically coupled to the second metal element through the substrate.   
     
     
         12 . The radio IC device according to  claim 2 , wherein
 at least one of the first and second electrodes includes a planar portion; and   the planar portion is electrically connected to the at least one of the metal case and the metal component.