Device for hardening an electrically conductive adhesive

Abstract

A device for curing an electrically conductive adhesive arranged between a first component and a second component. The device includes at least one punch to both apply a compressive force onto the first component in the direction of the second component, and introduce a current into the adhesive via the components.

1 - 19 . (canceled) 
     
     
         20 . A method for producing an adhesively bonded connection between a first component and a second component, the method comprising:
 applying an electrically conductive adhesive between the first component and the second component; and   curing the electrically conductive adhesive by applying a compressive force onto the first component in the direction of the second component, and introducing a current into electrically conductive adhesive via the first component and the second component.   
     
     
         21 . The method of  claim 20 , wherein the electrically conductive adhesive is cured via heating due to the current. 
     
     
         22 . The method of  claim 20 , wherein the current is introduced via the first component by a first punch. 
     
     
         23 . The method of  claim 20 , wherein the current is introduced via the second component by a second punch. 
     
     
         24 . The method of  claim 20 , wherein:
 the current is introduced via the first component by a first punch; and   the current is introduced via the second component by a second punch.   
     
     
         25 . The method of  claim 20 , further comprising:
 measuring a temperature of the first component; and   regulating the current introduced via the first component according to the measured temperature.   
     
     
         26 . The method of  claim 25 , wherein the temperature measurement is conducted by the first punch. 
     
     
         27 . A method for producing an adhesively bonded connection, the method comprising:
 introducing an electrically conductive adhesive between a first component and a second component; and   curing the electrically conductive adhesive to connect the first component and the second component, by applying a compressive force onto the first component and introducing a current into the first component and the second component.   
     
     
         28 . The method of  claim 26 , wherein the current is introduced via the second component by a second punch. 
     
     
         29 . The method of  claim 26 , wherein:
 the current is introduced via the first component by a first punch; and   the current is introduced via the second component by a second punch.   
     
     
         30 . The method of  claim 26 , further comprising:
 measuring a temperature of the first component; and   regulating the current introduced via the first component according to the measured temperature.   
     
     
         31 . The method of  claim 30 , wherein the temperature measurement is conducted by the first punch. 
     
     
         32 . A method for producing a connection, the method comprising:
 introducing an electrically conductive adhesive between first components laterally spaced apart from each other, and a common second component;   curing the electrically conductive adhesive to connect a first one of the first components and the second component, by applying a compressive force onto the first component and introducing a current into the first one of the first components; and   curing the electrically conductive adhesive to connect a second one of the first components and the second component, by applying a compressive force onto the first component and introducing a current into the first one of the first components.   
     
     
         33 . The method of  claim 32 , wherein the current is introduced into the first one of the first components via a first punch. 
     
     
         34 . The method of  claim 32 , wherein the current is introduced into the second one of the first components via a second punch. 
     
     
         35 . The method of  claim 32 , wherein:
 the current is introduced into the first one of the first components via a first punch; and   the current is introduced into the second one of the first components via a second punch.   
     
     
         36 . The method of  claim 32 , further comprising:
 measuring a temperature of the first one of the first components; and   regulating the current introduced via the first one of the first components according to the measured temperature.   
     
     
         37 . The method of  claim 36 , wherein the temperature measurement is conducted by the first punch. 
     
     
         38 . The method of  claim 32 , further comprising:
 measuring a temperature of the second one of the first components; and   regulating the current introduced via the second one of the first components according to the measured temperature.   
     
     
         39 . The method of  claim 38 , wherein the temperature measurement is conducted by the second punch. 
     
     
         40 . The method of  claim 32 , further comprising:
 measuring a temperature of the first one of the first components and regulating the current introduced via the first one of the first components according to the measured temperature; and   measuring a temperature of the second one of the first components and regulating the current introduced via the second one of the first components according to the measured temperature.