Led disposed in a body including a socket

Abstract

A device according to embodiments of the invention includes a light emitting diode (LED) mounted on an electrically conducting substrate. A lens is disposed over the LED. A polymer body is molded over the electrically conducting substrate and in direct contact with the lens.

1 . A device comprising:
 a light emitting diode (LED) mounted on an electrically conducting substrate;   an optical element disposed over the LED; and   a body formed over the electrically conducting substrate and in direct contact with the optical element but covering at most a portion of the optical element, the body comprising a bulb portion and a socket portion formed in a single, integrated structure.   
     
     
         2 . The device of  claim 1  wherein the substrate is a metal frame. 
     
     
         3 . The device of  claim 1  wherein the body is opaque and covers a portion of the optical element. 
     
     
         4 . The device of  claim 1  wherein the bulb portion and the socket portion comply with a standard. 
     
     
         5 . The device of  claim 1  further comprising a reference line disposed on the body, the reference line being defined by a standard. 
     
     
         6 . The device of  claim 1  further comprising a non-light-emitting electronic component electrically connected to the LED and disposed within the body. 
     
     
         7 . The device of  claim 6  wherein the non-light-emitting electronic component is one of an electrostatic discharge protection circuit, a power conditioning circuit, a driver circuit, a control circuit, a leaded resistor, and a leaded diode. 
     
     
         8 . The device of  claim 1  wherein the body has a thermal conductivity of at least 1 Watt/meter-Kelvin. 
     
     
         9 . The device of  claim 1  wherein the electrically conducting substrate is a metal with a thermal conductivity of at least 100 Watt/meter-Kelvin. 
     
     
         10 . The device of  claim 1  wherein a portion of the body is coated with an electrically insulating coating. 
     
     
         11 . The device of  claim 1  wherein a portion of the electrically conducting substrate is coated with an electrically insulating coating. 
     
     
         12 . A method comprising:
 attaching a light emitting diode (LED) to an electrically conducting substrate;   disposing an optical element over the LED; and   molding a body over the LED and the electrically conducting substrate such that the body directly contacts the optical element but covers at most a portion of the optical element;   wherein the body comprises a bulb portion and a socket portion formed in a single, integrated structure.   
     
     
         13 . The method of  claim 12  wherein the optical element protrudes from the body. 
     
     
         14 . The method of  claim 13  wherein
 the body is opaque plastic; and 
 the body covers a portion of the optical element. 
 
     
     
         15 . The method of  claim 12  wherein the bulb portion and the socket portion have a shape defined by a standard. 
     
     
         16 . The method of  claim 12  wherein the body has a thermal conductivity of at least 1 Watt/meter-Kelvin. 
     
     
         17 . The method of  claim 12  wherein the electrically conducting substrate is a metal with a thermal conductivity of at least 100 Watt/meter-Kelvin. 
     
     
         18 . The method of  claim 12  wherein a portion of the body is coated with an electrically insulating coating. 
     
     
         19 . The method of  claim 12  wherein a portion of the electrically conducting substrate is coated with an electrically insulating coating. 
     
     
         20 . The method of  claim 12 , further comprising electrically connecting a non-light-emitting electronic component to the LED.