Flexible light emitting semiconductor device

Abstract

A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one cavity extending from the second major surface toward the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer.

What is claimed is: 
     
         1 . An article comprising:
 a flexible polymeric dielectric layer having first and second major surfaces, the first major surface having a conductive layer directly thereon, the dielectric layer having at least one cavity extending from the second major surface toward the first major surface, the conductive layer including electrically separated first and second portions, each of the first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer.   
     
     
         2 . The article of  claim 1 , further comprising a thermal interface material disposed in the at least one cavity. 
     
     
         3 . The article of  claim 1 , wherein each cavity in the at least one cavity is filled with conductive material. 
     
     
         4 . The article of  claim 1  further comprising a light emitting semiconductor device supported and electrically connected to the conductive layer on the first major surface by the first and second portions. 
     
     
         5 . The article of  claim 1 , wherein the first and second portions of the conductive layer on the first major surface are electrically separated by a gap, and a thermal interface material is disposed in the gap. 
     
     
         6 . The article of  claim 1 , wherein the first portion is substantially aligned with a first cavity in the at least one cavity and the second portion is aligned with a different second cavity in the at least one cavity. 
     
     
         7 . The article of  claim 1 , wherein the dielectric layer further comprises at least one via extending from the second major surface to the first major surface 
     
     
         8 . The article of  claim 7 , wherein the first portion is substantially aligned with a first cavity in the at least one cavity and the second portion is aligned with a first via in the at least one via. 
     
     
         9 . The article of  claim 1 , wherein a first plane comprises the first major surface and at least some of the cavities in the at least one cavity has sloped side walls, the sloped side walls having side wall angles from about 5 degrees to about 60 degrees from the first plane. 
     
     
         10 . A flexible article comprising:
 a polymeric dielectric layer having a first major surface with a first electrically conductive layer directly thereon and having a second major surface, a first plane comprising the first major surface, a second plane comprising the second major surface, the dielectric layer disposed within a region between the first and second planes, the dielectric layer having at least one cavity extending from the second major surface toward the first major surface, the first electrically conductive layer comprising an electrically conductive feature substantially aligned with the at least one cavity, and a light emitting semiconductor device supported by the electrically conductive feature, the light emitting semiconductor device disposed outside the region between the first and second planes.   
     
     
         11 . The article of  claim 10 , wherein the conductive feature comprises electrically separated first and second portions supporting and electrically connecting the light emitting semiconductor device to the conductive layer on the first major surface. 
     
     
         12 . The article of  claim 10  further comprising a second electrically conductive layer on the second major surface of the dielectric layer. 
     
     
         13 . The article of  claim 10 , wherein the at least one cavity contains thermally conductive material. 
     
     
         14 . The article of  claim 10 , wherein each cavity in the at least one cavity is filled with conductive material. 
     
     
         15 . The article of  claim 10  further comprising a thermal interface layer abutting the second major surface and the thermally conductive material in the at least one cavity. 
     
     
         16 . The article of  claim 10 , wherein at least some of the cavities in the at least one cavity has sloped side walls, the sloped side walls having side wall angles from about 5 degrees to about 60 degrees from the first plane. 
     
     
         17 . An article comprising:
 a flexible dielectric layer having a first major surface with a first conductive layer directly thereon and having a second major surface, the dielectric layer having at least one cavity extending from the second major surface toward the first major surface, each cavity in the at least one cavity filled with conductive material, the first conductive layer comprising a conductive feature substantially aligned with the at least one cavity, and the first conductive layer further comprising conductive pads disposed adjacent the conductive feature.   
     
     
         18 . The article of  claim 17 , wherein the at least one cavity comprises two cavities, the first conductive layer comprising a conductive pad substantially aligned with each cavity. 
     
     
         19 . The article of  claim 17 , wherein a first plane comprises the first major surface and at least some of the cavities in the at least one cavity has sloped side walls, the sloped side walls having side wall angles from about 5 degrees to about 60 degrees from the first plane. 
     
     
         20 . The article of  claim 17  further comprising a light emitting semiconductor device supported by the conductive feature.