X-ray system, semiconductor package, and tray having x-ray absorption filter

Abstract

An X-ray source is disposed and a detector is disposed adjacent to the X-ray source. A test specimen holder is disposed between the X-ray source and the detector. A filter is disposed between the X-ray source and the test specimen holder. The filter has a plate-shaped semiconductor, a granular semiconductor, or a combination thereof.

What is claimed is: 
     
         1 . A semiconductor package, comprising:
 a semiconductor chip; and   a semiconductor filter adjacent to the semiconductor chip.   
     
     
         2 . The semiconductor package according to  claim 1 , wherein the semiconductor filter has the same or substantially the same material as a semiconductor substrate in the semiconductor chip. 
     
     
         3 . The semiconductor package according to  claim 1 , further comprising a semiconductor oxide film configured to cover a surface of the semiconductor filter. 
     
     
         4 . The semiconductor package according to  claim 1 , further comprising an encapsulant covering the semiconductor chip, wherein the semiconductor filter includes a granular semiconductor, and wherein the granular semiconductor is included in the encapsulant. 
     
     
         5 . The semiconductor package according to  claim 1 , further comprising a package substrate attached to the semiconductor chip, wherein the semiconductor filter includes a plate-shaped semiconductor, and wherein the plate-shaped semiconductor is formed in the package substrate or on a surface of the package substrate. 
     
     
         6 . The semiconductor package according to  claim 1 , further comprising a package substrate attached to the semiconductor chip, wherein the semiconductor filter includes a plate-shaped semiconductor, and wherein the plate-shaped semiconductor is formed between the package substrate and the semiconductor chip. 
     
     
         7 . The semiconductor package according to  claim 6 , further comprising a through electrode electrically connected to the package substrate and the semiconductor chip through the plate-shaped semiconductor. 
     
     
         8 . The semiconductor package according to  claim 1 , further comprising:
 a package substrate attached to the semiconductor chip; and   an underfill layer or an adhesive film disposed between the package substrate and the semiconductor chip,   wherein the semiconductor filter includes a granular semiconductor, and wherein the granular semiconductor is included in the underfill layer or the adhesive film.   
     
     
         9 . The semiconductor package according to  claim 1 , further comprising a coating film covering the semiconductor chip, wherein the semiconductor filter includes a granular semiconductor, and wherein the granular semiconductor is included in the coating film. 
     
     
         10 . A semiconductor package, comprising:
 a package substrate;   a first semiconductor chip having a semiconductor substrate and an active region formed thereon overlying the package substrate;   an encapsulant covering the first semiconductor chip; and   a semiconductor filter configured to transmit a hard X-ray and substantially prevent transmission of a soft X-ray and comprising a plate-shaped semiconductor, a granular semiconductor, or a combination thereof.   
     
     
         11 . The semiconductor package of  claim 10 , wherein the hard X-ray has a wavelength of about 10 nm to about 100 nm and wherein the soft X-ray has a wavelength of about 0.01 nm to about 10 nm. 
     
     
         12 . The semiconductor package of  claim 10 , further comprising a second semiconductor chip stacked on the first semiconductor chip. 
     
     
         13 . The semiconductor package of  claim 12 , further comprising a coating film covering the first semiconductor chip and the second semiconductor chip, wherein the encapsulant covers the coating film, and wherein the granular semiconductor is included in the coating film. 
     
     
         14 . The semiconductor package of  claim 13 , wherein the coating film covers upper and side surfaces of the first semiconductor chip and the second semiconductor chip. 
     
     
         15 . The semiconductor package of  claim 14 , further comprising bonding wires to electrically connect the second semiconductor chip with the package substrate, wherein the bonding wires pass through the coating film. 
     
     
         16 . The semiconductor package of  claim 10 , further comprising an adhesive layer disposed between the first chip and the package substrate, wherein the semiconductor filter includes the granular semiconductor, and wherein the granular semiconductor is included in the adhesive layer. 
     
     
         17 . The semiconductor package of  claim 10 , wherein the semiconductor filter is disposed to be spaced apart from the first semiconductor chip. 
     
     
         18 . A semiconductor package, comprising:
 a package substrate;   a semiconductor chip overlying the package substrate;   an encapsulant encapsulating the first semiconductor chip; and   a semiconductor filter adjacent to the semiconductor chip, the semiconductor chip configured to permit transmission of a hard X-ray and substantially prevent transmission of a soft X-ray to the first semiconductor chip from an X-ray source.   
     
     
         19 . The semiconductor package according to  claim 15 , further comprising a first coating film disposed between the first semiconductor chip and the package substrate, wherein the semiconductor filter includes the granular semiconductor, and wherein the granular semiconductor is included in the first coating film. 
     
     
         20 . The semiconductor package according to  claim 15 , further comprising a second coating film disposed between the first semiconductor chip and the second semiconductor chip, wherein the semiconductor filter includes the granular semiconductor, and wherein the granular semiconductor is included in the second coating film.