Method for Producing Patterned Materials

Abstract

A large area patterned film includes a first patterned area; a second patterned area; and a seam joining the first patterned area and the second patterned area, wherein the seam has a width less than about 20 micrometers. A method for tiling patterned areas includes depositing a predetermined thickness of a curable material; contacting a first portion of the curable material with a mold; curing the first portion of the curable material; removing the mold from the cured first portion of the curable material; contacting a second portion of the curable material with the mold, such that the mold contacts a portion of the cured first portion of the curable material; curing the second portion of the curable material; and removing the mold to yield a seam between the cured first portion of the curable material and the cured second portion of the curable material, wherein the seam has a dimension less than about 20 micrometers.

1 - 3 . (canceled) 
     
     
         4 . A method for tiling patterned areas, comprising:
 a. depositing a predetermined thickness of a curable material;   b. contacting a first portion of the curable material with a mold;   c. curing the first portion of the curable material;   d. removing the mold from the cured first portion of the curable material;   e. contacting a second portion of the curable material with the mold, such that the mold also contacts a portion of the cured first portion of the curable material;   f. curing the second portion of the curable material; and   g. removing the mold to yield a seam between the cured first portion of the curable material and the cured second portion of the curable material, wherein the seam has a dimension less than about 20 micrometers.   
     
     
         5 . The method of  claim 4 , further comprising, prior to step b., curing the curable material to a thickness less than the predetermined thickness such that a surface of the curable material remains substantially uncured. 
     
     
         6 . The method of  claim 5 , further comprising controlling a thickness of the substantially uncured surface by controlling an oxygen concentration to which the curable material is exposed. 
     
     
         7 . The method of  claim 4 , wherein the dimension of the seam is less than about 5 micrometers. 
     
     
         8 . The method of  claim 4 , wherein the dimension of the seam is less than about 500 nanometers. 
     
     
         9 . The method of  claim 4 , wherein curing the first portion of the curable material comprises treating substantially all of the curable material with radiation while the first portion of the curable material is substantially protected from exposure to oxygen. 
     
     
         10 . The method of  claim 4 , wherein curing the first portion of the curable material causes the first portion of the curable material to retain a pattern of the mold when the mold is removed from the first portion of the material. 
     
     
         11 . The method of  claim 4 , wherein curing the first portion of the curable material forms a first patterned region in the curable material and curing the second portion of the curable material forms a second patterned region in the curable material, and wherein the seam between the first patterned region and the second patterned region has a height less than about 1 micrometer. 
     
     
         12 . A method for fabricating a substantially seamless pattern, comprising;
 a. providing a first portion of curable material between a mold and a substrate proximate a nip point;   b. passing the first portion of curable material, the mold, and the substrate through the nip point;   c. curing the first portion of curable material to form a first cured portion;   d. removing the mold from the first cured portion;   e. providing a second portion of curable material over at least a portion of the first cured portion between the mold and the substrate;   f. passing the second portion of curable material, the mold, and the substrate through the nip point;   g. curing the second portion of curable material to form a second cured portion; and   h. removing the mold such that a seam between the first cured portion and the second cured portion has a dimension less than about 5 micrometers.   
     
     
         13 . The method of  claim 12 , wherein step b. results in depletion of the first portion of curable material prior to the mold and substrate exiting the nip point such that the curable material tapers to depletion between the mold and substrate. 
     
     
         14 . The method of  claim 13 , wherein providing a second portion of curable material in step e. results in adding the second portion of curable material to at least a portion of the depleted portion of the first cured portion such that the second portion substantially fills the tapered depletion to a pre-depletion thickness of curable material. 
     
     
         15 . The method of  claim 12 , wherein the mold comprises a fluoropolymer. 
     
     
         16 . The method of  claim 12 , wherein the dimension of the seam is less than about 1 micrometer. 
     
     
         17 . The method of  claim 12 , wherein the dimension of the seam is less than about 500 nanometers. 
     
     
         18 . The method of  claim 12 , wherein curing the first portion of curable material forms a first patterned region in the first cured portion and curing the second portion of curable material forms a second patterned region in the second cured portion, and wherein a seam between the first patterned region and the second patterned region has a dimension less than about 250 nanometers. 
     
     
         19 . A method for tiling patterned areas, comprising:
 distributing a first volume of curable material between a mold and a substrate, wherein when distributed the first volume undercoats the mold;   curing the first volume to form a first cured area;   separating the mold from the substrate, wherein the first cured area remains coupled with the substrate;   distributing a second volume of curable material adjacent the first cured area between the mold and the substrate, wherein when distributed the second volume undercoats the mold and overlaps the first cured area;   curing the second volume to form a second cured area; and   separating the mold from the substrate, wherein the first and second cured areas remain coupled with the substrate.   
     
     
         20 . The method of  claim 19 , wherein the overlapped first and second cured areas result in a seam having a dimension of less than about 20 micrometers. 
     
     
         21 . The method of  claim 20 , wherein the dimension of the seam is a width of the seam or a height of the seam. 
     
     
         22 . The method of  claim 20 , wherein the dimension is less than 1 micrometer and is a height dimension or a width dimension.