US2017323989A1PendingUtilityA1

Solar module structures and assembly methods for three-dimensional thin-film solar cells

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Assignee: OB REALTY LLCPriority: Oct 9, 2006Filed: May 23, 2017Published: Nov 9, 2017
Est. expiryOct 9, 2026(~0.2 yrs left)· nominal 20-yr term from priority
Y02E10/52H02S 40/36Y02E10/547Y10T117/1092Y02E10/546G03G 21/203H01L 31/05H01L 31/068H01L 31/022425H01L 31/02366H01L 31/0547H01L 31/049H01L 31/035281H01L 31/0504H01L 31/046H01L 31/048H01L 31/0352H01L 31/03529H01L 31/18H01L 31/182H01L 31/0488H01L 31/02363H01L 31/1896Y02B10/12H01L 31/022458H01L 31/056Y02P70/521H01L 31/042H10F 77/707H10F 77/703H10F 77/211H10F 77/148H10F 77/48H10F 77/14H10F 71/1395H10F 71/1221H10F 19/80H10F 10/14H10F 19/31Y02P70/50Y02B10/10
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Claims

Abstract

A method for assembling a solar module structure comprises patterning a frontside and a backside of a double-sided printed circuit board coated with metallic foils according to desired frontside and backside interconnect layouts; applying a first coating layer to the rear side of a plurality of three-dimensional thin-film solar cells, each three-dimensional thin-film solar cell comprising: a three-dimensional thin-film solar cell substrate comprising emitter junction regions and doped base regions; emitter metallization and base metallization regions; the three-dimensional thin-film solar cell substrate comprising a plurality of single-aperture unit cells; placing the three-dimensional thin-film solar cells on the frontside of the double-sided printed circuit board; preparing a solar module assembly, comprising: a glass layer; a top encapsulant layer; the plurality of three-dimensional thin-film solar cells on the frontside of the double-sided printed circuit board; a rear encapsulant layer; a protective back plate; and sealing and packaging the solar module assembly.

Claims

exact text as granted — not AI-modified
1 . A method for assembling a solar module structure, comprising:
 patterning a frontside and a backside of a double-sided printed circuit board coated with metallic foils according to desired frontside and backside interconnect layouts;   applying a first coating layer to the rear side of a plurality of three-dimensional thin-film solar cells, each three-dimensional thin-film solar cell comprising:
 a three-dimensional thin-film solar cell substrate comprising emitter junction regions and doped base regions; 
 emitter metallization regions; and 
 base metallization regions; 
 wherein said three-dimensional thin-film solar cell substrate comprises a plurality of single-aperture unit cells; 
   placing said plurality of three-dimensional thin-film solar cells on the frontside of said double-sided printed circuit board;   preparing a solar module assembly, comprising:
 a glass layer; 
 a top encapsulant layer; 
 said plurality of three-dimensional thin-film solar cells on the frontside of said double-sided printed circuit board; 
 a rear encapsulant layer; 
 a protective back plate; and 
   sealing and packaging said solar module assembly.   
     
     
         2 . The method for assembling a solar module structure of  claim 1 , wherein each three-dimensional thin-film solar cell further comprises a rear mirror. 
     
     
         3 . The method for assembling a solar module structure of  claim 1 , further comprising arranging a plurality of said solar module assemblies in series. 
     
     
         4 . The method for assembling a solar module structure of  claim 1 , further comprising arranging a plurality of said solar module assemblies in parallel. 
     
     
         5 . The method for assembling a solar module structure of  claim 3 , further comprising connecting at least one pair of module power output electrical leads. 
     
     
         6 . The method for assembling a solar module structure of  claim 4 , further comprising connecting at least one pair of module power output electrical leads.

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