US2017324009A1PendingUtilityA1

Optoelectronic system

56
Assignee: EPISTAR CORPPriority: Jul 4, 2003Filed: Jul 24, 2017Published: Nov 9, 2017
Est. expiryJul 4, 2023(expired)· nominal 20-yr term from priority
H10W 72/5524H10W 72/5522H10W 72/07554H10W 90/753H10W 72/9413H10W 90/00H10W 72/0198H10W 70/093H10W 99/00H10W 90/10H10W 72/241H10P 72/74H01L 33/56H01L 2924/12043H01L 33/486H01L 33/504H01L 2924/09701H01L 25/0756H01L 2924/01006H01L 2924/10329H01L 2924/01007H01L 2224/92H01L 2924/01078H01L 2924/01028H01L 2924/01094H01L 24/96H01L 2924/0103H01L 2924/01005H01L 25/0753H01L 2224/45124H01L 2924/12042H01L 2924/01049H01L 2224/4918H01L 2924/19041H01L 2924/01029H01L 2924/01047H01L 33/385H01L 2924/3025H01L 2224/48137H01L 24/24H01L 2924/014H01L 2924/12044H01L 2924/01015H01L 24/45H01L 2924/01033H01L 21/6835H01L 2924/14H01L 2224/24137H01L 24/82H01L 2224/45144H01L 2924/01031H01L 33/0079H01L 2224/82H01L 2224/48091H01L 2924/01013H01L 2924/10349H01L 2924/12041H01L 33/405H01L 2224/96H01L 2924/19042H01L 2924/01082H01L 33/508H01L 2924/01079H01L 2924/01014H01L 24/49H01L 33/507H10H 20/835H10H 20/018H10H 20/8516H10H 20/8515H10H 20/8506H10H 20/8314H10H 20/854H10H 20/8513
56
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Claims

Abstract

An embodiment of the invention discloses an optoelectronics system. The optoelectronic system includes an optoelectronic element having a top surface, a bottom surface, a plurality of lateral surfaces arranged between the top surface and the bottom surface, and a first electrode arranged on the bottom surface; a wavelength converting material covering a plurality of lateral surfaces; and a reflecting layer, formed on the wavelength converting material which is arranged on the top surface.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An optoelectronic system comprising:
 an optoelectronic element, having a top surface, a bottom surface, a plurality of lateral surfaces arranged between the top surface and the bottom surface, and a first electrode arranged on the bottom surface;   a wavelength converting material, covering a plurality of lateral surfaces; and   a reflecting layer, formed on the wavelength converting material which is arranged on the top surface.   
     
     
         2 . The optoelectronic system of  claim 1 , further comprising an adhesive arranged between the optoelectronic element and the reflecting layer. 
     
     
         3 . The optoelectronic system of  claim 2 , wherein the adhesive comprises silicone. 
     
     
         4 . The optoelectronic system of  claim 1 , wherein the wavelength converting material is arranged to surround the plurality of lateral surfaces. 
     
     
         5 . The optoelectronic system of  claim 1 , wherein the wavelength converting material directly contacts the plurality of lateral surfaces. 
     
     
         6 . The optoelectronic system of  claim 1 , wherein the wavelength converting material exposes the first electrode. 
     
     
         7 . The optoelectronic system of  claim 1 , wherein the wavelength converting material comprises different kinds of phosphors. 
     
     
         8 . The optoelectronic system of  claim 1 , wherein the reflecting layer is a sheet-like structure. 
     
     
         9 . The optoelectronic system of  claim 1 , wherein the reflecting layer has a portion extending beyond at least one of the plurality of lateral surfaces. 
     
     
         10 . The optoelectronic system of  claim 1 , further comprising a fan-out electrode electrically formed on the first electrode and arranged on the wavelength converting material. 
     
     
         11 . The optoelectronic system of  claim 1 , wherein the wavelength converting material has a sidewall through which light emitted from the optoelectronic element is configured to escape from the optoelectronic system. 
     
     
         12 . The optoelectronic system of  claim 1 , wherein the wavelength converting material comprises a first phosphor layer and a second phosphor layer overlapping the first phosphor layer. 
     
     
         13 . The optoelectronic system of  claim 2 , wherein the adhesive and the reflecting layer are laterally coplanar with each other. 
     
     
         14 . The optoelectronic system of  claim 1 , further comprising a substrate arranged on the reflecting layer. 
     
     
         15 . The optoelectronic system of  claim 1 , wherein the optoelectronic element further comprises a second electrode arranged on the bottom surface. 
     
     
         16 . The optoelectronic system of  claim 1 , further comprising a submount which the optoelectronic element is bonded to.

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