Illumination assembly including thermal energy management

Abstract

An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.

1 . An illumination assembly comprising:
 a polymeric substrate;   an electrical circuit including two conductors supported by the polymeric substrate;   a light source electrically coupled to the two conductors;   a heat spreader thermally coupled to the LED light source; and   a first polymeric layer comprising a thermoplastic material over-molded around at least portions of the polymeric substrate, the two conductors, the light source, and the heat spreader.   
     
     
         2 . The illumination assembly of  claim 1  wherein the polymeric substrate defines an aperture and wherein the heat spreader is thermally coupled to the light source through the aperture. 
     
     
         3 . (canceled) 
     
     
         4 . The illumination assembly of  claim 1  wherein the light source is not in direct contact with the heat spreader. 
     
     
         5 . The illumination assembly of  claim 1  comprising a thermally conductive and electrically insulating material between the light source and the heat spreader. 
     
     
         6 . The illumination assembly of  claim 1  wherein the two conductors are one of printed on the first polymeric substrate and at least partially embedded within the first polymeric substrate. 
     
     
         7 . An illumination assembly comprising:
 a polymeric substrate;   an electrical circuit including:
 a first pair of conductors at least partially embedded within the polymeric substrate; and 
 a second pair of conductors printed on the polymeric substrate; 
   a light source electrically coupled to the electrical circuit;   a heat spreader thermally coupled to the light source; and   a first polymeric layer over-molded around at least portions of the polymeric substrate, the electrical circuit, the lights source, and the heat spreader.   
     
     
         8 . The illumination assembly of  claim 7  wherein the second pair of conductors is electrically coupled to the first pair of conductors. 
     
     
         9 . The illumination assembly of  claim 7  wherein the light source is not in direct contact with the heat spreader. 
     
     
         10 . The illumination assembly of  claim 9  comprising a thermally conductive and electrically insulating material between the light source and the heat spreader. 
     
     
         11 . (canceled) 
     
     
         12 . The illumination assembly of  claim 7  wherein the first polymeric layer forms at least one of a mechanical seal and a moisture seal around the light source, the first pair of conductors, and the second pair of conductors. 
     
     
         13 . (canceled) 
     
     
         14 . The illumination assembly of  claim 7  wherein a first portion of the electrical circuit is disposed in a first plane, and a second portion of the electrical circuit is disposed in a second plane, different than the first plane. 
     
     
         15 . The illumination assembly of  claim 7  wherein the light source is electrically coupled to the first pair of conductors. 
     
     
         16 . A method of forming an illumination assembly comprising:
 forming a polymeric substrate having opposing first and second sides;   forming an electrical circuit including two conductors supported on the first side of the polymeric substrate;   electrically coupling a light source with the two conductors;   thermally coupling a heat spreader with the light source, the heat spreader at least primarily disposed on the second side of the polymeric substrate; and   over-molding a first polymeric layer over at least portions of the light source, the two conductors, the polymeric substrate, and the heat spreader.   
     
     
         17 . (canceled) 
     
     
         18 . The method of  claim 16  wherein the over-molding of the first polymeric layer forms at least one of a mechanical seal and a moisture seal between the light source, the two conductors, and the polymeric substrate. 
     
     
         19 . The method of  claim 16  wherein the heat spreader is entirely on the second side of the polymeric substrate, and the light source is not in direct contact with the heat spreader. 
     
     
         20 . The method of  claim 16  wherein the forming an electrical circuit comprises printing the two conductors onto the first side of the polymeric substrate.