Apparatus and methods for micro-transfer-printing

Abstract

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

1 - 74 . (canceled) 
     
     
         75 . A method for assembling a semiconductor device on a receiving surface of a destination substrate, the method comprising:
 providing the semiconductor device formed on a native substrate;   providing a conformable transfer device having a contact surface;   contacting the semiconductor device with the conformable transfer device in a vertical direction, wherein contact between the contact surface and the semiconductor device at least temporarily binds the semiconductor device to the conformable transfer device;   moving the lower of the conformable transfer device and the native substrate downward to separate the semiconductor device from the native substrate so that the semiconductor device is disposed on the contact surface of the conformable transfer device and is released from the native substrate;   contacting the semiconductor device disposed on the contact surface to the receiving surface of the destination substrate; and   separating the contact surface of the conformable transfer device from the semiconductor device so that the semiconductor device is transferred onto the receiving surface, thereby assembling the semiconductor device on the receiving surface of the destination substrate.   
     
     
         76 . The method of  claim 75 , comprising moving the upper of the conformable transfer device and the native substrate in an upward direction at the same time as the lower of the conformable transfer device and the native substrate is moved downward. 
     
     
         77 . The method of  claim 75 , wherein a post of the conformable transfer device is compressed in the vertical direction when contacting the semiconductor device with the conformable transfer device. 
     
     
         78 . The method of  claim 75 , wherein the separation of the semiconductor device and the native substrate occurs at an acceleration greater than or equal to five g. 
     
     
         79 . The method of  claim 75 , wherein the native substrate is disposed beneath the conformable transfer device when contacting the semiconductor device with the conformable transfer device in the vertical direction, and the native substrate is moved downward to separate the semiconductor device from the native substrate. 
     
     
         80 . The method of  claim 79 , wherein the conformable transfer device is moved upward at the same time that the native substrate is moved downward to separate the semiconductor device from the native substrate. 
     
     
         81 . The method of  claim 79 , wherein the conformable transfer device is held substantially stationary at the same time that the native substrate is moved downward to separate the semiconductor device from the native substrate. 
     
     
         82 . The method of  claim 75 , wherein the conformable transfer device is disposed beneath the native substrate when contacting the semiconductor device with the conformable transfer device in the vertical direction, and the conformable transfer device is moved downward to separate the semiconductor device from the native substrate. 
     
     
         83 . The method of  claim 82 , wherein the native substrate is moved upward at the same time that the conformable transfer device is moved downward to separate the semiconductor device from the native substrate. 
     
     
         84 . The method of  claim 82 , wherein the native substrate is held substantially stationary at the same time that the conformable transfer device is moved downward to separate the semiconductor device from the native substrate. 
     
     
         85 . A motion system for separating a semiconductor device formed on a native substrate from the native substrate, comprising:
 a conformable transfer device having a contact surface;   a vertical stage for holding the native substrate in vertical alignment with the conformable transfer device;   the vertical stage comprising a mechanism for:
 contacting the semiconductor device with the conformable transfer device in a vertical direction, wherein contact between the contact surface and the semiconductor device at least temporarily binds the semiconductor device to the conformable transfer device; and 
 moving the lower of the conformable transfer device and the native substrate downward to separate the semiconductor device from the native substrate so that the semiconductor device is disposed on the contact surface of the conformable transfer device and is released from the native substrate. 
   
     
     
         86 . The motion system of  claim 85 , wherein the mechanism:
 contacts the semiconductor device disposed on the contact surface to a receiving surface of a destination substrate disposed in or on the motion system; and   separates the contact surface of the conformable transfer device from the semiconductor device so that the semiconductor device is transferred onto the receiving surface, thereby assembling the semiconductor device on the receiving surface of the destination substrate.   
     
     
         87 . The motion system of  claim 85 , wherein the mechanism moves the upper of the conformable transfer device and the native substrate in an upward direction at the same time as the lower of the conformable transfer device and the native substrate is moved downward. 
     
     
         88 . The motion system of  claim 85 , wherein the conformable transfer device comprises a post providing the contact surface and wherein the mechanism compresses the post in the vertical direction when contacting the semiconductor device with the conformable transfer device. 
     
     
         89 . The motion system of  claim 85 , wherein the mechanism separates the semiconductor device and the native substrate at an acceleration greater than or equal to five g. 
     
     
         90 . The motion system of  claim 85 , wherein the vertical stage holds the native substrate beneath the conformable transfer device when contacting the semiconductor device with the conformable transfer device in the vertical direction, and the mechanism moves the native substrate downward to separate the semiconductor device from the native substrate. 
     
     
         91 . The motion system of  claim 90 , wherein the mechanism moves the conformable transfer device upward at the same time that the native substrate is moved downward to separate the semiconductor device from the native substrate. 
     
     
         92 . The motion system of  claim 85 , wherein the vertical stage holds the conformable transfer device beneath the native substrate when contacting the semiconductor device with the conformable transfer device in the vertical direction, and the mechanism moves the conformable transfer device downward to separate the semiconductor device from the native substrate. 
     
     
         93 . The motion system of  claim 92 , wherein the mechanism moves the native substrate upward at the same time that the conformable transfer device is moved downward to separate the semiconductor device from the native substrate. 
     
     
         94 . The motion system of  claim 85 , wherein the mechanism holds the upper of the conformable transfer device and the native substrate substantially stationary at the same time as the lower of the conformable transfer device and the native substrate is moved downward.