Printed circuit board structure

Abstract

Provided is a printed circuit board structure that needs minimum manufacturing costs and in which there is little possibility that a solder bridge is formed. The printed circuit board structure is formed with via holes for electrically conductively connecting electrically conductive layers of a printed circuit board, and the via holes include a coated via hole with a land coated with solder resist and a non-coated via hole with a land not coated with solder resist, wherein the coated via hole is arranged in a place of the printed circuit board where a solder bridge or a solder ball is highly likely to be generated, and is electrically connected to at least one of the non-coated via hole in parallel.

What is claimed is: 
     
         1 . A printed circuit board structure comprising:
 a plurality of via holes for electrically conductively connecting a plurality of electrically conductive layers of a printed circuit board, the plurality of via holes including a coated via hole with a land coated with solder resist and a non-coated via hole with a land not coated with solder resist,   wherein   the coated via hole is arranged in a place of the printed circuit board where a solder bridge or a solder ball is highly likely to be generated, and is electrically connected to at least one of the non-coated via hole in parallel.   
     
     
         2 . The printed circuit board structure according to  claim 1 , wherein the coated via hole is arranged in a place where a distance between adjacent via holes is equal to or less than a predetermined distance, one of the adjacent via holes is a coated via hole and an other of the adjacent via holes is a non-coated via hole. 
     
     
         3 . The printed circuit board structure according to  claim 1 , wherein the coated via hole is arranged in a place where a distance from a metal member arranged on the printed circuit board is equal to or less than a predetermined distance. 
     
     
         4 . The printed circuit board structure according to  claim 1 , comprising:
 a first region in which an electronic component is soldered by a flow process or a dip process; and   a second region protected from solder by a masking jig when soldering is performed in the first region, wherein:   the coated via hole is present in the first region and arranged in a place where a distance from a boundary with the second region is equal to or less than a predetermined distance.   
     
     
         5 . The printed circuit board structure according to  claim 1 , wherein the coated via hole is arranged on a power supply voltage pattern unit of the printed circuit board to which a power supply voltage is fed. 
     
     
         6 . The printed circuit board structure according to  claim 1 , wherein the coated via hole is connected to a ground pattern unit of the printed circuit board to be grounded.