Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure

Abstract

An endblock for a rotatable sputtering target, such as a rotatable magnetron sputtering target, is provided. A sputtering apparatus, including one or more such endblock(s), includes locating the electrical contact(s) (e.g., brush(es)) between the collector and rotor in the endblock(s) in an area under vacuum (as opposed to in an area at atmospheric pressure).

1 - 18 . (canceled) 
     
     
         19 . A method of making a coated article, the method comprising:
 sputtering a rotating target in a chamber at pressure less than atmospheric pressure to sputter-deposit a layer on a substrate, wherein the target is supported by an endblock, the endblock including a fixed conductive collector, a rotatable conductive rotor rotating with the sputtering target during said sputtering, an electrical power transfer structure located between the fixed conductive collector and the rotatable rotor for transferring electrical power from the collector to the rotor,   providing the endblock in a position, so that during said sputtering the electrical power transfer structure, the rotor, and the collector are each located in the area under vacuum having pressure less than atmospheric pressure.