Heat exchanger puck

Abstract

Apparatuses and methods associated with heat exchanger puck design are disclosed herein. In embodiments, a heat exchanger puck may include a first plate with a cavity that extends into the first plate from a side of the first plate and a second plate. The second plate may be coupled to the side of the first plate, with the cavity located between the first plate and the second plate. The heat exchanger puck may further include a tube of a liquid coolant system located, at least partially, within the cavity, the tube formed to fit the cavity created by the first plate and the second plate. Other embodiments may be described and/or claimed.

What is claimed is: 
     
         1 . A heat exchanger puck, comprising:
 a first plate of the heat exchanger puck with a cavity that extends into the first plate from a side of the first plate;   a second plate of the heat exchanger puck coupled to the side of the first plate with the cavity located between the first plate and the second plate; and   a tube of a liquid coolant system located, at least partially, within the cavity, the tube formed to fit the cavity created by the first plate and the second plate.   
     
     
         2 . The heat exchanger puck of  claim 1 , wherein the first plate is to contact the tube around a first portion of a circumference of the tube and the second plate is to contact the tube around a second portion of the circumference. 
     
     
         3 . The heat exchanger puck of  claim 2 , wherein the first portion of the circumference and the second portion of the circumference together are an entirety of the circumference of the tube. 
     
     
         4 . The heat exchanger puck of  claim 1 , wherein the cavity is a first cavity, and wherein the second plate comprises a second cavity that extends into the second plate from a side of the second plate coupled to the first plate, wherein the second cavity is aligned with the first cavity, to at least partially receive the tube. 
     
     
         5 . The heat exchanger puck of  claim 1 , wherein a width of the cavity increases as the cavity extends into the first plate from the side of the first plate, and wherein a side wall of the first plate contacts the tube where the width of the cavity has increased from the side of the first plate. 
     
     
         6 . The heat exchanger puck of  claim 1 , wherein the first plate and the second plate are cold plates. 
     
     
         7 . The heat exchanger puck of  claim 1 , wherein the tube is formed to a pentagon shape. 
     
     
         8 . The heat exchanger puck of  claim 1 , wherein the tube is formed to fit the cavity created by the first plate and the second plate while the tube resides within the cavity created by the first plate and the second plate. 
     
     
         9 . A liquid coolant system, comprising:
 a tube to carry liquid coolant within the liquid coolant system;   a pump coupled to the tube to provide pressure to move the liquid coolant within the tube; and   a heat exchanger puck coupled to a portion of the tube, the portion of the tube located within a cavity of the heat exchanger puck and formed to fit the cavity by the heat exchanger puck, wherein the heat exchanger puck is to be attached to an electronic component.   
     
     
         10 . The liquid coolant system of  claim 9 , wherein the portion of the tube is formed to a shape based on a predetermined pressure drop associated with the portion of the tube. 
     
     
         11 . The liquid coolant system of  claim 9 , wherein the heat exchanger puck includes a first plate and a second plate, the cavity of the heat exchanger puck formed between the first plate and the second plate, and wherein the portion of the tube is formed to fit the cavity by the first plate and the second plate as the first plate is affixed to the second plate. 
     
     
         12 . The liquid coolant system of  claim 9 , wherein the heat exchanger puck includes a first plate and a second plate, the cavity of the heat exchanger puck formed between the first plate and the second plate, and wherein the first plate and the second plate are constructed of thermal conductive material to transfer heat to the liquid coolant carried within the tube. 
     
     
         13 . A method of manufacturing a heat exchanger puck, comprising:
 compressing a first plate of the heat exchanger puck and a second plate of the heat exchanger puck together, the first plate and the second plate forming a cavity between the first plate and the second plate, wherein a portion of a tube of a liquid coolant system is located within the cavity and the compression causes the portion of the tube to deform;   affixing the second plate to the side of the first plate.   
     
     
         14 . The method of  claim 13 , further comprising:
 applying epoxy to the side of the first plate, wherein affixing the second plate to the side of the first plate includes curing the epoxy while the first plate and the second plate are compressed together.   
     
     
         15 . The method of  claim 13 , further comprising:
 reducing a thickness of the first plate by a flycut process applied to the first plate after affixing of the second plate to the side of the first plate.   
     
     
         16 . The method of  claim 13 , further comprising:
 hydroforming the portion of the tube to the first plate and the second plate after affixing the second plate to the side of the first plate.   
     
     
         17 . The method of  claim 16 , wherein the hydroforming of the portion of the tube causes a circumference of the portion of the tube to expand. 
     
     
         18 . The method of  claim 17 , wherein the circumference of the portion of the tube expands to fill the cavity. 
     
     
         19 . The method of  claim 16 , wherein the hydroforming of the portion of the tube causes a reduction in tube wall thickness of the portion of the tube. 
     
     
         20 . The method of  claim 13 , further comprising attaching the heat exchanger puck to an electronic component to be cooled by the heat exchanger puck. 
     
     
         21 . A method of manufacturing a heat exchanger puck, comprising:
 affixing a first portion of the heat exchanger puck to a second portion of the heat exchanger puck with a portion of a tube of a liquid coolant system located in a cavity formed between the first portion and the second portion of the heat exchanger puck; and   hydroforming the portion of the tube within the cavity.   
     
     
         22 . The method of  claim 21 , further comprising:
 applying a thermal epoxy to the first portion of the heat exchanger puck; and   compressing the first portion and the second portion of the heat exchanger puck together, wherein affixing the first portion of the heat exchanger puck to the second portion of the heat exchanger puck includes curing the thermal epoxy while the first portion and the second portion of the heat exchanger puck are compressed together.   
     
     
         23 . The method of  claim 21 , further comprising:
 machining the first portion of the heat exchanger puck with a first portion of the cavity extending into the first portion of the heat exchanger puck; and   machining the second portion of the heat exchanger puck with a second portion of the cavity extending into the second portion of the heat exchanger puck, wherein affixing the first portion of the heat exchanger puck to the second portion of the heat exchanger puck includes aligning the first portion of the cavity with the second portion of the cavity while affixing the first portion of the heat exchanger puck to the second portion of the heat exchanger puck.   
     
     
         24 . The method of  claim 21 , further comprising:
 applying a force to one or both of the first portion of the heat exchanger puck and the second portion of the heat exchanger puck to maintain affixation of the first portion of the heat exchanger puck to the second portion of the heat exchanger puck while hydroforming the portion of the tube; and   removing the force after hydroforming the portion of the tube.   
     
     
         25 . The method of  claim 21 , wherein hydroforming the portion of the tube includes expanding the tube to fill the cavity.