Topical copper ion treatments and methods of treatment using same in the oral-respiratory-otic areas of the body

Abstract

Copper ion treatments and methods of treatment are provided to treat various body conditions affecting the oral, respiratory and/or otic areas of the body. The copper ion treatments contain copper ions which bring about local and systemic therapeutic effects as a result of contacting anatomical tissue of the oral cavity, the nasal passages or ear canal. The copper ion treatments and methods involve copper ion-containing solutions, copper ion toothpaste and copper ion mouthwash. The copper ion-containing solutions can be delivered to the oral cavity by spraying or swabbing, can be delivered to the nostrils as spray, drops, or by swabbing, and can be delivered to the ear canal as spray, drops, or by swabbing. The copper ion toothpaste is used for brushing the teeth, and the copper ion mouthwash is used for rinsing the mouth.

1 . A method for making a copper ion treatment, comprising:
 (a) placing a solid copper metal in a solution;   (b) heating the solution to a predetermined temperature;   (c) allowing the solid copper metal to remain in the solution for at least one hour; and   (d) removing the solid copper metal from the solution.   
     
     
         2 . The method of  claim 1 , wherein:
 the predetermined temperature is 37° C.±1° C.   
     
     
         3 . The method of  claim 1 , wherein:
 the solid copper metal remains in the solution for 8 to 72 hours.   
     
     
         4 . The method of  claim 3 , wherein:
 the solid copper metal remains in the solution for about 8 hours.   
     
     
         5 . The method of  claim 3 , wherein:
 the solid copper metal remains in the solution for about 24 hours.   
     
     
         6 . The method of  claim 3 , wherein:
 the solid copper metal remains in the solution for about 72 hours.   
     
     
         7 . The method of  claim 1 , wherein:
 the solution is a buffered saline solution.   
     
     
         8 . The method of  claim 7 , wherein:
 the solution is a saline solution buffered with acetic acid and acetate.   
     
     
         9 . The method of  claim 8 , wherein:
 the solution is a saline solution buffered with acetic acid and acetate at a pH of 5±0.4.   
     
     
         10 . The method of  claim 1 , wherein:
 after the removing step, the solution contains copper ions in a concentration equal or substantially equal to 6.18 mg/oz.   
     
     
         11 . The method of  claim 10 , wherein:
 after the removing step, the solution contains copper ions in a concentration equal or substantially equal to 6.18 mg/oz when analyzed for copper content by inductively coupled plasma/optical emission spectroscopy (ICP/OES).   
     
     
         12 . The method of  claim 1 , further comprising:
 mixing the solution with a carrier; wherein the carrier is selected from a group consisting of a cream, a gel, a lotion, a foam, and a paste.   
     
     
         13 . The method of  claim 12 , wherein:
 after the mixing step, the solution constitutes 5% to 30% by weight of total weight of the solution and the carrier.   
     
     
         14 . The method of  claim 1 , further comprising:
 applying the solution to a carrier; wherein the carrier is selected from a group consisting of a suppository, a tampon, a body wipe, a wound dressing, a skin patch, and a suture material.   
     
     
         15 . The method of  claim 7 , further comprising:
 mixing the solution with a carrier; wherein the carrier is selected from a group consisting of a cream, a gel, a lotion, a foam, and a paste.   
     
     
         16 . The method of  claim 15 , wherein:
 after the mixing step, the solution constitutes 5% to 30% by weight of total weight of the solution and the carrier.   
     
     
         17 . The method of  claim 7 , further comprising:
 applying the solution to a carrier; wherein the carrier is selected from a group consisting of a suppository, a tampon, a body wipe, a wound dressing, a skin patch, and a suture material.