Device package and methods for the fabrication and testing thereof

Abstract

Method of making an optoelectronic device package.

What is claimed is: 
     
         1 . A method of making an optoelectronic device package, comprising:
 providing a base substrate comprising an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region;   forming a fiber groove in the base substrate disposed along an optical axis at a location external to the lid mounting region;   bonding an optoelectronic device to the optoelectronic device mounting region;   mounting a lid on the lid mounting region to form an enclosed volume between the base substrate and the lid, wherein the optoelectronic device is in the enclosed volume, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path;   providing an optical fiber segment in the fiber groove; and   placing an encapsulant over the optical element and/or the fiber segment.   
     
     
         2 . The method of  claim 1 , wherein the lid comprises silicon. 
     
     
         3 . The method of  claim 1 , comprising oxidizing a sidewall portion of a silicon lid through its depth to provide an optically transmissive silicon dioxide sidewall region.