Carrier ultra thin substrate

Abstract

Method of forming ultra thin coreless substrates are described. In an embodiment, the method utilizes a debond layer including high and low adhesion surface areas to the carrier substrate, and cutting through the low adhesion surface areas to remove a build-up structure from the carrier substrate. An electrical short layer may be formed as a part of or on the debond layer to facilitate electrical testing of the build-up structure prior to debonding, and aid in the formation a “known good” substrate on a support substrate.

What is claimed is: 
     
         1 . A substrate strip comprising:
 a support substrate including rectangular lateral dimensions;   an adhesive layer on the support substrate;   a build-up structure attached to the adhesive layer, the build-up structure comprising a bottom surface including a bottom plurality of contact pads, and a top surface including a top plurality of contact pads.   
     
     
         2 . The substrate strip of  claim 1 , wherein the build-up structure is less than 100 μm thick. 
     
     
         3 . The substrate strip of  claim 1 , wherein the bottom surface of the build-up structure additionally includes ground routing. 
     
     
         4 . The substrate strip of  claim 1 , wherein the build-up structure includes an array of package routings and an array of ground routings arranged in molding groups, arranged such that each package routing includes a ground routing around a periphery of the package routing. 
     
     
         5 . The substrate strip of  claim 4 , wherein each molding group contains a plurality of package routings and a plurality of ground routings. 
     
     
         6 . The substrate strip of  claim 5 , wherein adjacent package routings within a molding group share a ground routing. 
     
     
         7 . The substrate strip of  claim 4 , wherein the array of ground routings is electrically separated from the array of package routings. 
     
     
         8 . The substrate strip of  claim 4 , further comprising a barrier metal on the plurality of surface mount contact pads. 
     
     
         9 . The substrate strip of  claim 4 , wherein the build-up structure comprises a single metal routing layer. 
     
     
         10 . The substrate strip of  claim 4 , wherein the build-up structure comprises one to three metal routing layers. 
     
     
         11 . The substrate strip of  claim 4 , wherein each molding group contains a plurality of rows and columns of package routings. 
     
     
         12 . The substrate strip of  claim 11 , wherein the molding groups are arranged in single line along a length of the substrate strip. 
     
     
         13 . The substrate strip of  claim 4 , wherein a first portion of the bottom plurality of contact pads is in contact with the array of ground routings. 
     
     
         14 . The substrate strip of  claim 13 , wherein a second portion of the top plurality of contact pads is in contact with the array of ground routings. 
     
     
         15 . The substrate strip of  claim 13 , wherein the bottom plurality of contact pads is a plurality of ball grid array (B GA) contact pads. 
     
     
         16 . The substrate strip of  claim 15 , wherein the top plurality of contacts pads is a plurality of surface mount contact pads. 
     
     
         17 . A packaging substrate comprising:
 a support substrate;   an adhesive layer on the support substrate;   a build-up structure attached to the adhesive layer, the build-up structure comprising:   a bottom surface including a bottom plurality of contact pads;   a top surface including a top plurality of contact pads; and   an array of package routings and an array of ground routings arranged in molding groups, arranged such that each package routing includes a ground routing around a periphery of the package routing.   
     
     
         18 . The packaging substrate of  claim 17 , wherein each molding group contains a plurality of package routings and a plurality of ground routings. 
     
     
         19 . The packaging substrate of  claim 18 , wherein adjacent package routings within a molding group share a ground routing. 
     
     
         20 . The packaging substrate of  claim 17 , wherein the array of ground routings is electrically separated from the array of package routings.