Server memory cooling apparatus

Abstract

A system to aid in cooling an in-line memory module may include a heat spreader including a channel to accommodate the in-line memory module, thermal interface material, and a liquid-cooler block including a heat-conducting cold plate and an internal liquid channel filled with circulating cooling liquid. Also disclosed are systems employing tubes to convey cooling fluid.

What is claimed is: 
     
         1 . A thermal management apparatus for cooling one or more in-line memory modules, comprising:
 a manifold including a plurality of parallel cooling tubes each having a first end and a second end, wherein each of the cooling tubes is made of a heat-conducting material,   wherein each of the plurality of cooling tubes is configured to contain a cooling liquid, and   wherein the plurality of cooling tubes are spaced apart from one another so as to receive at least one in-line memory module between adjacent cooling tubes;   a first chamber fluidly coupled to the first ends of the plurality of cooling tubes so that each of the first ends terminates at the first chamber;   a second chamber fluidly coupled to the second ends of the plurality of cooling tubes so that each of the second ends terminates at the second chamber;   a first connector fluidly coupled to the first chamber for fluidly attaching the first chamber to a cooling circuit, wherein the first connector and the first chamber are configured to flow the cooling liquid from the first connector, through the first chamber, to the plurality of cooling tubes; and   a second connector fluidly coupled to the second chamber for fluidly attaching the second chamber to the cooling circuit, wherein the second connector and the second chamber are configured to flow the cooling liquid from the plurality of cooling tubes through the second chamber to the second connector.   
     
     
         2 . The thermal management apparatus of  claim 1 , wherein at least one of the plurality of cooling tubes has a thermal adhesive on an outer surface for contacting the at least one in-line memory module. 
     
     
         3 . The thermal management apparatus of  claim 1 , wherein a height of each of the plurality of cooling tubes is about equal to a height of the at least one in-line memory module. 
     
     
         4 . The thermal management apparatus of  claim 1 , wherein each of the plurality of cooling tubes is dimensioned to accommodate multiple in-line memory modules positioned end to end length-wise. 
     
     
         5 . The thermal management apparatus of  claim 1 , wherein at least two of the plurality of cooling tubes are arranged side-by-side to accommodate multiple in-line memory modules width-wise between them. 
     
     
         6 . The thermal management apparatus of  claim 1 , wherein the plurality of cooling tubes are flat rectangular shaped. 
     
     
         7 . The thermal management apparatus of  claim 1 , wherein the plurality of cooling tubes each have a height approximately equal to a height of the one or more in-line memory modules. 
     
     
         8 . The thermal management apparatus of  claim 1 , wherein the plurality of cooling tubes each have a height of about 16 mm, a width of about 2.2 mm, and a spacing of about 7.2 mm between adjacent cooling tubes.