Devices including metal layer

Abstract

Devices having an air bearing surface (ABS) and including a write pole; a near field transducer (NFT) that includes a peg and a disc, wherein the peg includes a rear peg portion and a peg tip, the rear peg portion and the peg tip are different materials and the peg tip includes: one or more metals; one or more nanoparticles comprising oxides, nitrides, carbides or combinations thereof; one or more conducting oxides, conducting nitrides, conducting bromides, conducting carbides, or combinations thereof; one or more semiconductors; or combinations thereof.

What is claimed is: 
     
         1 . A device having an air bearing surface (ABS), the device comprising:
 a write pole;   a near field transducer (NFT) comprising a peg and a disc, wherein the peg has an entire length and comprises a rear peg portion and a peg tip, wherein the peg tip is from 1% to 80% of the length of the entire peg, wherein the rear peg portion and the peg tip are different materials and the peg tip comprises:   one or more metals selected from: gold (Au), silver (Ag), aluminum (Al), copper (Cu), rhodium (Rh), ruthenium (Ru), iridium (Ir), niobium (Nb), tantalum (Ta), titanium (Ti), chromium (Cr), zirconium (Zr), palladium (Pd), vanadium (V), molybdenum (Mo), cobalt (Co), magnesium (Mg), iron (Fe), platinum (Pt), nickel (Ni), manganese (Mn), indium (In), scandium (Sc), yttrium (Y), gallium (Ga), hafnium (Hf), zinc (Zn), gadolinium (Gd), holmium (Ho), terbium (Tb), samarium (Sm), dysprosium (Dy), neodymium (Nd), or combinations thereof;   one or more metals selected from gold (Au), silver (Ag), aluminum (Al), copper (Cu), rhodium (Rh), ruthenium (Ru), iridium (Ir), niobium (Nb), tantalum (Ta), titanium (Ti), chromium (Cr), zirconium (Zr), palladium (Pd), vanadium (V), molybdenum (Mo), cobalt (Co), magnesium (Mg), iron (Fe), platinum (Pt), nickel (Ni), manganese (Mn), indium (In), scandium (Sc), yttrium (Y), gallium (Ga), hafnium (Hf), zinc (Zn), gadolinium (Gd), holmium (Ho), terbium (Tb), samarium (Sm), dysprosium (Dy), neodymium (Nd), or combinations thereof and nanoparticles comprising oxides, nitrides, carbides or combinations thereof;   one or more conducting oxides, conducting nitrides, conducting bromides, conducting carbides, or combinations thereof;   one or more semiconductors; or   combinations thereof.   
     
     
         2 . The device according to  claim 1 , wherein the peg tip portion comprises rhodium (Rh), iridium (Ir), platinum (Pt), palladium (Pd), radium (Ra), rhenium (Re), silicon (Si), ruthenium (Ru), nickel (Ni), chromium (Cr), or combinations thereof. 
     
     
         3 . The device according to  claim 1 , wherein the peg tip portion comprises rhodium (Rh), iridium (Ir), platinum (Pt), or combinations thereof. 
     
     
         4 . The device according to  claim 1 , wherein the peg tip portion comprises iridium (Ir), platinum (Pt), palladium (Pd), nickel (Ni), rhodium (Rh), ruthenium (Ru), or combinations thereof. 
     
     
         5 . The device according to  claim 1 , wherein the peg tip portion comprises iron oxide (FeO), indium oxide (InO), ruthenium oxide (RuO), chromium oxide (CrO), tantalum oxide (TaO), niobium oxide (NbO), titanium oxide (TiO), yttrium oxide (YO), copper oxide (CuO), indium tin oxide (ITO), tin oxide (SnO), or combinations thereof. 
     
     
         6 . The device according to  claim 1 , wherein the peg tip portion comprises tantalum oxide (TaO), niobium oxide (NbO), titanium oxide (TiO), or combinations thereof. 
     
     
         7 . The device according to  claim 1 , wherein the peg tip portion comprises iron oxide (FeO). 
     
     
         8 . The device according to  claim 1 , wherein the peg tip portion has a length of not greater than 50 nm and not less than 0.5 nm. 
     
     
         9 . The device according to  claim 1 , wherein the peg tip portion has a length of not greater than 15 nm and not less than 2 nm. 
     
     
         10 . The device according to  claim 1  further comprising an adhesion layer positioned between the peg tip and the rear peg portion. 
     
     
         11 . The device according to  claim 1 , wherein the rear peg portion comprises gold (Au), silver (Ag), aluminum (Al), copper (Cu), ruthenium (Ru), rhodium (Rh), iridium (Ir), platinum (Pt), or alloys thereof; titanium nitride (TiN), zirconium nitride (ZrN), aluminum nitride (AlN), tantalum nitride (TaN), indium tin oxide (ITO), aluminum zinc oxide (Al:ZnO), gallium zinc oxide (Ga:ZnO) or combinations thereof; thermally conductive oxides; or combinations thereof. 
     
     
         12 . A device having an air bearing surface (ABS), the device comprising:
 a write pole;   a near field transducer (NFT) comprising a peg and a disc, wherein the peg comprises a rear peg portion and a peg tip, wherein the peg has an entire length and comprises a rear peg portion and a peg tip, wherein the peg tip is from 1% to 80% of the length of the entire peg, and wherein the rear peg portion and the peg tip are different materials and and the peg tip comprises:   one or more metals selected from: gold (Au), silver (Ag), aluminum (Al), copper (Cu), rhodium (Rh), ruthenium (Ru), iridium (Ir), niobium (Nb), tantalum (Ta), titanium (Ti), chromium (Cr), zirconium (Zr), palladium (Pd), vanadium (V), molybdenum (Mo), cobalt (Co), magnesium (Mg), iron (Fe), platinum (Pt), nickel (Ni), manganese (Mn), indium (In), scandium (Sc), yttrium (Y), gallium (Ga), hafnium (Hf), zinc (Zn), gadolinium (Gd), holmium (Ho), terbium (Tb), samarium (Sm), dysprosium (Dy), neodymium (Nd), or combinations thereof;   iron oxides, ruthenium oxide (RuO), zinc oxide (ZnO), nickel oxide (NiO), chromium oxide (Cr 2 O 3 ), indium oxide (In 2 O 3 ), or combinations thereof, aluminum zinc oxide (Al:ZnO), gallium zinc oxide (Ga:ZnO), sodium zinc oxide (Na:ZnO), indium tin oxide (ITO), lithium nickel oxide (Li:NiO), magnesium chromium oxide (Mg:Cr 2 O 3 ), nitrogen chromium oxide (N:Cr 2 O 3 ), magnesium and nitrogen co-doped Cr 2 O 3 , copper chromium oxide (CuCrO 2 ), magnesium copper chromium oxide (Mg:CuCrO 2 ), magnesium zinc oxide (Mg 1-x Zn x O), indium magnesium zinc oxide (In:Mg 1-x Zn x o), aluminum magnesium zinc oxide (Al:Mg 1-x Zn x O), magnesium aluminum oxide (Mg 12 Al 14 O 33 ), tantalum oxide (TaO), niobium oxide (NbO), titanium oxide (TiO), yttrium oxide (YO), copper oxide (CuO), tin oxide (SnO); or   combinations thereof.   
     
     
         13 . The device according to  claim 12 , wherein the peg tip portion comprises rhodium (Rh), iridium (Ir), platinum (Pt), palladium (Pd), radium (Ra), rhenium (Re), silicon (Si), ruthenium (Ru), nickel (Ni), chromium (Cr), or combinations thereof. 
     
     
         14 . The device according to  claim 12 , wherein the peg tip portion comprises iron oxide (FeO), indium oxide (InO), ruthenium oxide (RuO), chromium oxide (CrO), tantalum oxide (TaO), niobium oxide (NbO), titanium oxide (TiO), yttrium oxide (YO), copper oxide (CuO), indium tin oxide (ITO), tin oxide (SnO), or combinations thereof. 
     
     
         15 . The device according to  claim 12 , wherein the peg tip portion has a length of not greater than 50 nm and not less than 0.5 nm. 
     
     
         16 . The device according to  claim 12 , wherein the peg tip portion has a length of not greater than 15 nm and not less than 2 nm. 
     
     
         17 . The device according to  claim 12  further comprising an adhesion layer positioned between the peg tip and the rear peg portion. 
     
     
         18 . The device according to  claim 12 , wherein the rear peg portion comprises gold (Au), silver (Ag), aluminum (Al), copper (Cu), ruthenium (Ru), rhodium (Rh), iridium (Ir), platinum (Pt), or alloys thereof titanium nitride (TiN), zirconium nitride (ZrN), aluminum nitride (AlN), tantalum nitride (TaN), indium tin oxide (ITO), aluminum zinc oxide (Al:ZnO), gallium zinc oxide (Ga:ZnO) or combinations thereof; thermally conductive oxides; or combinations thereof. 
     
     
         19 . A device having an air bearing surface (ABS), the device comprising:
 a write pole;   a near field transducer (NFT) comprising a peg and a disc, wherein the peg comprises a rear peg portion and a peg tip, wherein the peg has an entire length and comprises a rear peg portion and a peg tip, wherein the peg tip is from 1% to 80% of the length of the entire peg, and wherein the rear peg portion and the peg tip are different materials and the peg tip comprises:   one or more metals selected from: rhodium (Rh), iridium (Ir), platinum (Pt), palladium (Pd), radium (Ra), rhenium (Re), silicon (Si), ruthenium (Ru), nickel (Ni), chromium (Cr), or combinations thereof;   iron oxide, indium oxide (InO), ruthenium oxide (RuO), chromium oxide (CrO), tantalum oxide (TaO), niobium oxide (NbO), titanium oxide (TiO), yttrium oxide (YO), copper oxide (CuO), indium tin oxide (ITO), tin oxide (SnO), or combinations thereof; or combinations thereof.   
     
     
         20 . The device according to  claim 19 , wherein the peg tip portion has a length of not greater than 15 nm and not less than 2 nm.