Method for manufacturing a swallowable sensor device

Abstract

Methods and systems for manufacturing a swallowable sensor device are disclosed. Such a method includes mechanically coupling a plurality of internal components, wherein the plurality of internal components includes a printed circuit board having a plurality of projections extending radially outward. A cavity is filled with a potting material, and the mechanically coupled components are inserted into the cavity. The cavity may be pre-filled with the potting material, or may be filled after the mechanically coupled components have been inserted therein. A distal end of each projection abuts against a wall of the cavity thereby preventing the potting material from covering each distal end. The cavity is sealed with a cap causing the potting material to harden within the sealed cavity to form a housing of the swallowable sensor device, wherein the distal end of each projection is exposed to an external environment of the swallowable sensor device.

1 . A method for mechanically and electrically coupling internal components of a swallowable sensor device, comprising:
 preparing a plurality of printed circuit (PC) boards having opposing first and second surfaces, wherein each PC board has one or more spacers disposed on the first surface, a plurality of holes extending between the first and second surfaces, and a keyed hole extending between the first and second surfaces;   placing each PC board on a conductor that is aligned with the keyed hole of each PC board, such that the one or more spacers of a first PC board abut against the second surface of a second PC board; and   inserting a plurality of conductors through the plurality of holes in each PC board.   
     
     
         2 . A method for mechanically and electrically coupling internal components of a swallowable sensor device, comprising:
 preparing a plurality of printed circuit (PC) boards having opposing first and second surfaces, wherein each PC board has a plurality of keyed holes extending between the first and second surfaces;   placing each PC board on conductors aligned with the keyed holes of each PC board to form a PC assembly;   compressing the PC assembly with a pre-determined pressure; and   connecting a first and last PC board of the PC assembly to the conductors.   
     
     
         3 . A method for testing swallowable sensor devices, comprising
 providing an assembly having a plurality of wells formed therein, each well having sensor connection points that are electrically coupled to edge connection points;   urging the respective swallowable sensor devices into the respective wells formed in the assembly, wherein test points on the respective swallowable sensor devices are electrically connected to the sensor connection points of the respective wells; and   sending electrical signals through the edge connection points to test the swallowable sensor devices.   
     
     
         4 . The method of  claim 3 , further comprising:
 sealing the swallowable sensor devices within the assembly.   
     
     
         5 . The method of  claim 1 , further comprising:
 inserting the plurality of PC boards into a molding cavity.   
     
     
         6 . The method of  claim 1 , further comprising:
 inserting the plurality of PC boards into a molding cavity pre-filled with potting material.   
     
     
         7 . The method of  claim 1 , further comprising:
 inserting the plurality of PC boards into a molding cavity; and   injecting the molding cavity with potting material in response to the inserting.   
     
     
         8 . The method of  claim 1 , further comprising:
 covering a portion of the plurality of PC boards with potting material; and   curing the potting material with oxygen.   
     
     
         9 . The method of  claim 1 , further comprising:
 covering a portion of the plurality of PC boards with an acoustically transmissive substance.   
     
     
         10 . The method of  claim 1 , further comprising:
 covering a portion of the plurality of PC boards with a digestible material.   
     
     
         11 . The method of  claim 2 , wherein the compressing further comprises:
 determining the pre-determined pressure based on a distance of compression.   
     
     
         12 . The method of  claim 2 , further comprising:
 trimming the conductors flush to a surface of the first and last PC board.   
     
     
         13 . The method of  claim 2 , further comprising:
 placing a transducer with keyed holes on the conductors of the PC assembly.   
     
     
         14 . The method of  claim 2 , further comprising:
 placing a battery on the conductors of the PC assembly.   
     
     
         15 . The method of  claim 2 , wherein the connecting further comprises:
 coupling the first and last PC board of the PC assembly to expose a first external conductor protruding from the first PC board and a second external conductor protruding from the last PC board.   
     
     
         16 . The method of  claim 15 , further comprising:
 coupling the first external conductor and the second external conductor to a housing of the swallowable sensor device.   
     
     
         17 . The method of  claim 15 , further comprising:
 adding potting material to the PC assembly such that the first external conductor and the second external conductor remain uncovered by the potting material.   
     
     
         18 . The method of  claim 3 , wherein the providing further comprises:
 placing the assembly on a mold that includes a plurality of wells; and   heating the assembly such that portions of the assembly form into the plurality of wells based on the plurality of wells of the mold.   
     
     
         19 . The method of  claim 3 , wherein the providing further comprises:
 forming the assembly such that the electrical coupling of the sensor connection points to the edge connection points follows a three dimensional pathway.   
     
     
         20 . The method of  claim 3 , wherein the urging further comprises:
 moving the assembly on a conveyor belt;   depositing the respective swallowable sensor devices into the respective wells of the assembly; and   applying pressure to the respective swallowable sensor devices to couple the test points on the respective swallowable sensor devices to the sensor connection points of the respective wells.