Heated capacitor and method of forming the heated capacitor

Abstract

A heated capacitor runs current through either a lower metal plate, an upper metal plate, a lower metal trace that lies adjacent to a lower metal plate, an upper metal trace that lies adjacent to an upper metal plate, or both a lower metal trace that lies adjacent to a lower metal plate and an upper metal trace that lies adjacent to an upper metal plate to generate heat from the resistance to remove moisture from a moisture-sensitive insulating layer.

What is claimed is: 
     
         1 . A heated capacitor comprising:
 a first pad;   a second pad;   a non-conductive layer;   a first metal structure that touches the non-conductive layer;   a second metal structure that touches the non-conductive layer; and   a heater of the heated capacitor, the heater including a first connection between the second metal structure and the first pad and a second connection between the second metal structure and the second pad, wherein the first metal structure lies directly above the second metal structure, and the non-conductive layer lies between the first and second metal structures.   
     
     
         2 . The heated capacitor of  claim 1 , wherein the non-conductive layer includes a polymer. 
     
     
         3 . The heated capacitor of  claim 1 , wherein the non-conductive layer comprises polymide. 
     
     
         4 . The heated capacitor of  claim 1 , wherein the first metal structure comprises copper. 
     
     
         5 . The heated capacitor of  claim 1 , wherein the first metal structure comprises aluminum. 
     
     
         6 . The heated capacitor of  claim 1 , wherein the second metal structure comprises copper. 
     
     
         7 . The heated capacitor of  claim 1 , wherein the second metal structure comprises aluminum. 
     
     
         8 . The heated capacitor of  claim 1 , the second metal structure being connected to the first pad to receive a first voltage and the second pad to receive a second voltage, the first voltage and the second voltage being different, the difference between the first voltage and the second voltage to cause a current to flow into, through, and out of the second metal structure, the current to generate heat from a resistance of the second metal structure, the heat to remove moisture from the non-conductive layer. 
     
     
         9 . The heated capacitor of  claim 1 , further comprising:
 a first bond wire connected to the first pad;   a second bond wire connected to the second pad; and   a third bond wire connected to the first metal structure.   
     
     
         10 . A heated capacitor comprising:
 a first pad;   a second pad;   a non-conductive layer;   a first metal structure that touches the non-conductive layer;   a second metal structure that touches the non-conductive layer; and   a heater of the heated capacitor, the heater including a first connection between the second metal structure and the first pad and a second connection between the second metal structure and the second pad, wherein the first metal structure lies directly below the second metal structure, and the non-conductive layer lies between the first and second metal structures.   
     
     
         11 . The heated capacitor of  claim 10 , wherein the non-conductive layer includes a polymer. 
     
     
         12 . The heated capacitor of  claim 10 , wherein the non-conductive layer comprises polymide. 
     
     
         13 . The heated capacitor of  claim 10 , wherein the first metal structure comprises copper. 
     
     
         14 . The heated capacitor of  claim 10 , wherein the first metal structure comprises aluminum. 
     
     
         15 . The heated capacitor of  claim 10 , wherein the second metal structure comprises copper. 
     
     
         16 . The heated capacitor of  claim 10 , wherein the second metal structure comprises aluminum. 
     
     
         17 . The heated capacitor of  claim 10 , the second metal structure being connected to the first pad to receive a first voltage and the second pad to receive a second voltage, the first voltage and the second voltage being different, the difference between the first voltage and the second voltage to cause a current to flow into, through, and out of the second metal structure, the current to generate heat from a resistance of the second metal structure, the heat to remove moisture from the non-conductive layer. 
     
     
         18 . A heated capacitor comprising:
 a first pad;   a second pad;   a non-conductive layer comprising polymide;   a first metal structure that touches the non-conductive layer;   a second metal structure that touches the non-conductive layer;   a first connection between a first end of the second metal structure and the first pad and a second connection between a second end of the second metal structure and the second pad, wherein the first metal structure lies directly above the second metal structure, and the non-conductive layer lies between the first and second metal structures;   a first bond wire connected to the first pad;   a second bond wire connected to the second pad; and   a third bond wire connected to the first metal structure.   
     
     
         19 . The heated capacitor of  claim 18 , wherein the first metal structure and the second metal structure comprises copper. 
     
     
         20 . The heated capacitor of  claim 18 , wherein the first metal structure and the second metal structure comprises aluminum.