Apparatus and method for treating substrate

Abstract

Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.

1 .- 13 . (canceled) 
     
     
         14 . A method for treating a substrate, the method comprising:
 carrying a substrate into a housing;   placing the substrate on a support member;   supplying a process fluid to the substrate;   preventing the process fluid from being directly injected to the substrate;   discharging the process fluid from the housing; and   carrying the substrate out of the housing.   
     
     
         15 . The method of  claim 14 , wherein the preventing of the process fluid is performed using a shield plate disposed between the support member and a supply port through which the process fluid is supplied. 
     
     
         16 . The method of  claim 15 , wherein the supplying of the process fluid port is performed by injecting the process fluid toward a topside of the substrate through a first supply port disposed at an upper surface of the housing and injecting the process fluid toward a rear side of the substrate through a second supply port disposed at a lower surface of the housing, and
 the preventing of the process fluid is performed using the shield plate disposed between the second support port and the support member so as to prevent the process fluid injected toward the rear side of the substrate from being directly injected to the substrate.   
     
     
         17 . The method of  claim 16 , wherein in the supplying of the process fluid, the process fluid is injected through the second supply port, and if an inside pressure of the housing reaches a preset value, the process fluid is started to be injected through the first supply port. 
     
     
         18 . The method of  claim 14 , wherein the process fluid is a supercritical fluid, and the supercritical fluid dissolves an organic solvent remaining on the substrate. 
     
     
         19 . The apparatus of  claim 14 , wherein the housing comprises an upper housing and a lower housing disposed under the upper housing,
 the substrate is placed on the support member in a state where the upper housing and the lower housing are spaced apart from each other, and   after the substrate is carried into the housing, one of the upper housing and the lower housing is lifted or lowered to close the housing.   
     
     
         20 . A method for treating a substrate, the method comprising: carrying a substrate on which an organic solvent remains into a housing; creating a supercritical atmosphere in the housing by supplying a supercritical fluid toward a non-patterned side of the substrate while preventing the supercritical fluid from being directly injected to the substrate; and after the supercritical atmosphere is created, injecting the process fluid to a patterned side of the substrate to dissolve the organic solvent remaining between circuit patterns of the substrate and dry the substrate. 
     
     
         21 . The method of  claim 20 , wherein the supercritical fluid is prevented from being directly injected to the substrate by a shield member disposed on a path along which the supercritical fluid is injected toward the non-patterned side of the substrate. 
     
     
         22 . The method of  claim 20 , wherein the supercritical fluid is supercritical carbon dioxide.