Bonding method and bonded structure

Abstract

A bonding target member typically has a solid bonding material with aluminum as a main component interposed between a metal member and a ceramic member. These elements and an elastic member are pressurized by a pressurizing section and a bonding tool section of a resonator in a vertical direction. The bonding tool section of the resonator resonates with sound vibration or ultrasound vibration transmitted from an oscillator. The metal member and the ceramic member can alternatively be bonded together without the intermediate bonding material. In both cases, bonding at ordinary temperature in the atmosphere is possible. When the ceramic member has a thickness resistant to pressurization and vibration energy at the time of bonding to resist cracking, the elastic member may be disposed on the metal member side, or may not be used.

What is claimed is: 
     
         1 . A bonding method wherein a bonding target member is formed in a laminated shape with a metal member and a ceramic member, a resin pad is disposed on either one or both of above and below the bonding target member and, in a state in which the bonding target member and the resin pad are pressurized in a vertical direction, a resonator resonates with sound vibration or ultrasound vibration transmitted from an oscillator attached to one end of the resonator to vibrate in a lateral direction orthogonal to a pressurized direction to cause the metal member and the ceramic member to be bonded together. 
     
     
         2 . The bonding method according to  claim 1 , wherein
 the metal member is configured to be a solid made of aluminum in a sheet shape, a foil shape, a film shape, a plate shape, or a block.   
     
     
         3 . The bonding method according to  claim 1 , wherein
 the ceramic member is configured to be a solid in a sheet shape, a foil shape, a film shape, a plate shape, or a block.