US2018111860A1PendingUtilityA1

Substrate processing apparatus, process fluid treating apparatus, and ozone decomposition method

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Assignee: SEMES CO LTDPriority: Oct 26, 2016Filed: Oct 24, 2017Published: Apr 26, 2018
Est. expiryOct 26, 2036(~10.2 yrs left)· nominal 20-yr term from priority
Inventors:Junhee YounSeung-Hwan Cho
H10P 72/0414H10P 72/0402H10P 72/0448H10P 72/0451H01L 21/67051B08B 3/08B08B 3/14C02F 1/727C02F 2101/10C02F 1/58C02F 1/78C02F 1/34C02F 2301/024C02F 2301/046C02F 2303/18C02F 2103/346H10P 72/0431H10P 14/6508H10P 70/15
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Claims

Abstract

Disclosed are a substrate processing apparatus and a process fluid treating apparatus. The substrate processing apparatus includes a process chamber that processes a substrate with a process fluid including ozone, a discharge conduit connected to the process chamber to discharge the process fluid used to process the substrate, and a process fluid treating apparatus connected with the discharge conduit. The process fluid treating apparatus includes a housing having an inner space with a set volume in which the process fluid is received and an injection nozzle connecting the discharge conduit and the inner space of the housing.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A substrate processing apparatus comprising:
 a process chamber configured to process a substrate with a process fluid including ozone;   a discharge conduit connected to the process chamber to discharge the process fluid used to process the substrate; and   a process fluid treating apparatus connected with the discharge conduit,   wherein the process fluid treating apparatus includes:   a housing having an inner space with a set volume in which the process fluid is received; and   an injection nozzle configured to connect the discharge conduit with the inner space of the housing.   
     
     
         2 . The substrate processing apparatus of  claim 1 , wherein the injection nozzle is configured to inject the process fluid downwards. 
     
     
         3 . The substrate processing apparatus of  claim 1 , wherein the injection nozzle includes a plurality of injection holes through which the process fluid is injected. 
     
     
         4 . The substrate processing apparatus of  claim 1 , wherein the injection nozzle is configured to inject the process fluid by a spray method. 
     
     
         5 . The substrate processing apparatus of  claim 1 , wherein the process fluid treating apparatus further includes:
 a strike plate located inside the housing such that a top side of the strike plate faces the process fluid injected through the injection nozzle.   
     
     
         6 . The substrate processing apparatus of  claim 5 , wherein the process fluid treating apparatus further includes:
 a gas supply conduit configured to supply gas including oxygen into the inner space of the housing.   
     
     
         7 . The substrate processing apparatus of  claim 6 , wherein the process fluid treating apparatus further includes:
 a circulation line having opposite ends connected to the housing, the circulation line being configured to allow the process fluid discharged from the housing to flow into the housing again.   
     
     
         8 . The substrate processing apparatus of  claim 1 , wherein the process fluid treating apparatus further includes:
 a gas supply conduit configured to supply gas including oxygen into the inner space of the housing.   
     
     
         9 . The substrate processing apparatus of  claim 8 , wherein the process fluid treating apparatus further includes:
 a strike plate located inside the housing such that a top side of the strike plate faces the process fluid injected through the injection nozzle, and   wherein the gas supply conduit includes an upper injection part extending toward the inner space of the housing and configured to inject the gas into a space between the injection nozzle and the strike plate.   
     
     
         10 . The substrate processing apparatus of  claim 8 , wherein the gas supply conduit includes a lower injection part extending toward the inner space of the housing and configured to inject the gas into the process fluid received in the inner space of the housing. 
     
     
         11 . The substrate processing apparatus of  claim 1 , wherein the process fluid treating apparatus further includes:
 a circulation line having opposite ends connected to the housing, the circulation line being configured to allow the process fluid discharged from the housing to flow into the housing again.   
     
     
         12 . The substrate processing apparatus of  claim 11 , wherein the circulation line has a turbulence creating part therein to allow the process fluid flowing through the circulation line to become turbulent. 
     
     
         13 . The substrate processing apparatus of  claim 12 , wherein the turbulence creating part has a plate shape with one or more flow holes. 
     
     
         14 . The substrate processing apparatus of  claim 13 , wherein the flow holes are formed to be inclined with respect to an axial direction of the circulation line. 
     
     
         15 . The substrate processing apparatus of  claim 12 , wherein the turbulence creating part includes a first plate and a second plate configured to block a part of a flow passage inside the circulation line and located to have different slopes with respect to an axial direction of the circulation line. 
     
     
         16 . The substrate processing apparatus of  claim 11 , wherein a pump is located on the circulation line. 
     
     
         17 . The substrate processing apparatus of  claim 11 , wherein a heater is located on the circulation line. 
     
     
         18 . The substrate processing apparatus of  claim 11 , wherein a circulation nozzle is located at one end of the circulation line through which the process fluid flowing through the circulation line flows into the housing again. 
     
     
         19 . The substrate processing apparatus of  claim 18 , wherein the circulation nozzle is configured to inject the process fluid downwards. 
     
     
         20 . The substrate processing apparatus of  claim 11 , wherein the process fluid treating apparatus further includes:
 a strike plate located inside the housing such that a top side of the strike plate faces the process fluid injected through the injection nozzle.   
     
     
         21 . The substrate processing apparatus of  claim 11 , wherein the process fluid treating apparatus further includes:
 a gas supply conduit configured to supply gas including oxygen into the inner space of the housing.   
     
     
         22 . A process fluid treating apparatus comprising:
 a housing having an inner space with a set volume in which a process fluid including ozone is received;   a discharge conduit connected to the housing to supply the process fluid into the inner space of the housing; and   a strike plate located in a moving path of the process fluid introduced by the discharge conduit.   
     
     
         23 . The process fluid treating apparatus of  claim 22 , further comprising:
 an injection nozzle located on an end portion of the discharge conduit to inject the process fluid into the inner space of the housing.   
     
     
         24 . A process fluid treating apparatus comprising:
 a housing having an inner space with a set volume in which a process fluid including ozone is received;   a discharge conduit connected to the housing to supply the process fluid into the inner space of the housing; and   a circulation line having opposite ends connected to the housing, the circulation line being configured to allow the process fluid discharged from the housing to flow into the housing again.   
     
     
         25 . The process fluid treating apparatus of  claim 24 , wherein the circulation line has a turbulence creating part therein to allow the process fluid flowing through the circulation line to become turbulent. 
     
     
         26 . The process fluid treating apparatus of  claim 24 , wherein a pump is located on the circulation line. 
     
     
         27 . The process fluid treating apparatus of  claim 24 , wherein a heater is located on the circulation line. 
     
     
         28 . The process fluid treating apparatus of  claim 24 , wherein a circulation nozzle configured to inject the process fluid downwards is located at one end of the circulation line through which the process fluid flowing through the circulation line flows into the housing again. 
     
     
         29 . A method of decomposing ozone included in a process fluid, the method comprising:
 recovering the process fluid, which includes the ozone and has been used to process a substrate, into an inner space of a housing, wherein the process fluid is injected into the inner space of the housing by a spray method.   
     
     
         30 . The method of  claim 29 , wherein the process fluid is injected toward a strike plate disposed in the inner space of the housing. 
     
     
         31 . The method of  claim 29 , further comprising:
 circulating the process fluid injected into the housing through a circulation line and decomposing the ozone by using a force applied to the process fluid in the circulation process.   
     
     
         32 . The method of  claim 31 , wherein the process fluid flows through the circulation line while creating turbulence. 
     
     
         33 . The method of  claim 31 , wherein the process fluid is heated while flowing through the circulation line. 
     
     
         34 . The method of  claim 29 , wherein gas including oxygen is supplied into the inner space of the housing. 
     
     
         35 . The method of  claim 34 , wherein the gas is supplied to a part into which the process fluid is injected. 
     
     
         36 . The method of  claim 34 , wherein the gas is supplied into the process fluid that is received in the housing after injected.

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