Method of determining curing conditions, method of producing circuit device, and circuit device

Abstract

A method of determining curing conditions is for determining the curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component. A curing degree curve is created. The curing degree curve indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin. On the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin, at a first heating temperature, is calculated. The first heating temperature is one of the heating temperatures.

What is claimed is: 
     
         1 . A device with a thermosetting resin cured by:
 creating a curing degree curve which indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin;   calculating, on the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin at a first heating temperature which is one of the heating temperatures; and   determining a time based on the calculated void removal time, as a heating time at the first heating temperature,   wherein,
 the calculating includes (a) converting the created curing degree curve to viscosity of the thermosetting resin, and (b) calculating the void removal time based on an equation representing a state of the natural upward movement of the void, using as a parameter the viscosity obtained from the conversion, 
 the equation representing the state of the natural upward movement of the void further uses as a parameter a diameter of the void, and 
 the calculation of the void removal time includes calculating the void removal time based on an equation representing relationship between the diameter of the void and a pressure being applied to the void. 
   
     
     
         2 . The device of  claim 1  comprising a conductive part sealed between a substrate and an electronic component by means of the thermosetting resin. 
     
     
         3 . A device with a thermosetting resin cured by:
 calculating, on the basis of a curing degree curve, a void removal time of a void naturally moving upward in a thermosetting resin at a first heating temperature which is one of plural heating temperatures, in which the curing degree curve indicates, with respect to each of the heating temperatures, relationship between heating time and curing degree of the thermosetting resin;   providing the thermosetting resin onto a substrate so as to cover a solder part provided on an electrode on the substrate;   placing an electronic component on the substrate in such a manner that an electrode of the electronic component or a solder part provided on this electrode confronts the solder part provided on the electrode on the substrate being provided with the thermosetting resin;   heating the thermosetting resin at the first heating temperature, until a time based on the void removal time obtained by the calculation elapses from starting heating; and   heating the thermosetting resin at a second heating temperature after the time based on the void removal time has elapsed from starting heating, the second heating temperature being lower than the first heating temperature.   
     
     
         4 . The device of  claim 3  comprising a conductive part sealed between a substrate and an electronic component by means of the thermosetting resin.