Nerve cuff electrodes fabricated using over-molded lcp substrates

Abstract

An electrode lead may comprise a flexible circuit that includes a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on the other end of the lead substrate portion, wherein the lead substrate portion is pre-shaped into a three-dimensional structure. The flexible circuit may further include an electrically conductive trace extending from the connector substrate portion to the electrode carrying substrate portion, a first window formed in the connector substrate portion to expose the electrically conductive trace to form a connector pad, and a second window formed in the electrode carrying substrate portion to expose the electrically conductive trace to form an electrode pad. The electrode lead may further comprise a lead connector that incorporates the connector substrate portion.

1 . An electrode lead, comprising:
 an elongated planar lead body pre-shaped into a three-dimensional structure;   a lead connector disposed at a proximal end of the lead body;   an electrode carrying structure disposed at a distal end of the lead body;   at least one connector contact carried by the lead connector;   at least one electrode contact carried by the electrode carrying structure; and   at least one electrical conductor extending through the lead body between the at least one connector contact and the at least one electrode contact.   
     
     
         2 . The electrode lead of  claim 1 , wherein the three-dimensional structure is a helical structure. 
     
     
         3 . The electrode lead of  claim 1 , wherein the three-dimensional structure is a sigmoid structure. 
     
     
         4 . The electrode lead of  claim 1 , wherein the electrode carrying structure is planar. 
     
     
         5 . The electrode lead of  claim 4 , wherein the electrode carrying structure comprises a biologically compatible, elastic, electrically insulative cuff body affixed to the distal end of the lead body, the cuff body configured for being circumferentially disposed around a nerve, wherein the at least one electrode contact is affixed to the cuff body. 
     
     
         6 . The electrode lead of  claim 5 , wherein the at least one electrode contact is configured for being on an inner surface of the cuff body when circumferentially disposed around a nerve. 
     
     
         7 . The electrode lead of  claim 4 , wherein the electrode carrying structure comprises a biologically compatible, elastic, electrically insulative paddle body affixed to the distal end of the lead body. 
     
     
         8 . The electrode lead of  claim 1 , wherein the lead body comprises an outer layer of insulative material composed of one of silicone, polyurethane, polyether polyurethane, polycarbonate polyurethane, parylene, perfluoroalkoxy alkanes (PFA), and polytetrafluoroethylene (PTFE). 
     
     
         9 . The electrode lead of  claim 1 , wherein the lead body comprises a planar dielectric substrate. 
     
     
         10 . The electrode lead of  claim 9 , wherein the planar dielectric substrate is composed of liquid crystal polymer (LCP). 
     
     
         11 . The electrode lead of  claim 9 , wherein each of the at least one electrical conductor is an electrically conductive trace embedded within the planar dielectric substrate. 
     
     
         12 . The electrode lead of  claim 1 , wherein the at least one electrode contact comprises three electrode contacts in a tripolar electrode arrangement. 
     
     
         13 . The electrode lead of  claim 1 , wherein the lead connector is configured for being inserted into a corresponding connector of a neurostimulator. 
     
     
         14 . A flexible circuit, comprising:
 a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on the other end of the lead substrate portion, wherein the lead substrate portion is pre-shaped into a three-dimensional structure;   an electrically conductive trace extending from the connector substrate portion to the electrode carrying substrate portion;   a first window formed in the connector substrate portion to expose the electrically conductive trace to form a connector pad; and   a second window formed in the electrode carrying substrate portion to expose the electrically conductive trace to form an electrode pad.   
     
     
         15 . The flexible circuit of  claim 14 , wherein the three-dimensional structure is a helical structure. 
     
     
         16 . The flexible circuit of  claim 14 , wherein the three-dimensional structure is a sigmoid structure. 
     
     
         17 . The flexible circuit of  claim 14 , wherein the electrode carrying substrate portion is an enlarged cuff substrate portion pre-shaped into a cuff sized for being circumferentially disposed around a nerve. 
     
     
         18 . The flexible circuit of  claim 17 , wherein the cuff substrate portion is rectangular. 
     
     
         19 . The flexible circuit of  claim 17 , wherein the electrode pad is configured for facing a nerve when the cuff substrate portion is circumferentially disposed around a nerve. 
     
     
         20 . The flexible circuit of  claim 14 , wherein the electrode carrying substrate portion is an enlarged paddle substrate portion. 
     
     
         21 . The flexible circuit of  claim 14 , further comprising an outer layer of insulative material disposed over the planar dielectric substrate, the insulative material composed of one of silicone, polyurethane, polyether polyurethane, polycarbonate polyurethane, parylene, perfluoroalkoxy alkanes (PFA), and polytetrafluoroethylene (PTFE). 
     
     
         22 . The flexible circuit of  claim 14 , wherein the planar dielectric substrate is composed of liquid crystal polymer (LCP). 
     
     
         23 .- 256 . (canceled)