Nerve cuff electrodes fabricated using over-molded lcp

Abstract

An electrode lead may comprise a flexible circuit that includes a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on the other end of the lead substrate portion, wherein the lead substrate portion is pre-shaped into a three-dimensional structure. The flexible circuit may further include an electrically conductive trace extending from the connector substrate portion to the electrode carrying substrate portion, a first window formed in the connector substrate portion to expose the electrically conductive trace to form a connector pad, and a second window formed in the electrode carrying substrate portion to expose the electrically conductive trace to form an electrode pad. The electrode lead may further comprise a lead connector that incorporates the connector substrate portion.

1 .- 154 . (canceled) 
     
     
         155 . An electrode lead, comprising:
 an elongated lead body having a proximal end and a distal end;   a lead connector including a planar connector substrate disposed at a proximal end of the lead body, at least one connector contact carried by the connector substrate, and a rigid cylindrical rod having an outer surface on which the connector substrate is affixed, such that at least one connector contact faces outward away from the cylindrical rod;   an electrode carrying structure disposed at a distal end of the lead body;   at least one electrode contact carried by the electrode carrying structure; and   at least one electrical conductor extending through the lead body between the at least one connector contact and the at least one electrode contact.   
     
     
         156 . The electrode lead of  claim 155 , wherein the connector substrate is pre-shaped to conform to the outer surface of the cylindrical rod. 
     
     
         157 . The electrode lead of  claim 155 , wherein the lead body is planar. 
     
     
         158 . The electrode lead of  claim 155 , wherein the electrode carrying structure is planar. 
     
     
         159 . The electrode lead of  claim 158 , wherein the electrode carrying structure comprises a biologically compatible, elastic, electrically insulative cuff body affixed to the distal end of the lead body, the cuff body configured for being circumferentially disposed around a nerve, wherein the at least one electrode contact is affixed to the cuff body. 
     
     
         160 . The electrode lead of  claim 159 , wherein the at least one electrode contact is configured for being on an inner surface of the cuff body when circumferentially disposed around a nerve. 
     
     
         161 . The electrode lead of  claim 158 , wherein the electrode carrying structure comprises a biologically compatible, elastic, electrically insulative paddle body affixed to the distal end of the lead body. 
     
     
         162 . The electrode lead of  claim 155 , further comprising an outer layer of insulative material composed of one of silicone, polyurethane, polyether polyurethane, polycarbonate polyurethane, parylene, perfluoroalkoxy alkanes (PFA), and polytetrafluoroethylene (PTFE). 
     
     
         163 . The electrode lead of  claim 155 , wherein the connector substrate is a planar dielectric substrate. 
     
     
         164 . The electrode lead of  claim 163 , wherein the planar dielectric substrate is composed of liquid crystal polymer (LCP). 
     
     
         165 . The electrode lead of  claim 163 , wherein each of the at least one electrical conductor is an electrically conductive trace embedded within the planar dielectric substrate. 
     
     
         166 . The electrode lead of  claim 155 , wherein the at least one electrode contact comprises three electrode contacts in a tripolar electrode arrangement. 
     
     
         167 . The electrode lead of  claim 155 , wherein the lead connector is configured for being inserted into a corresponding connector of a neurostimulator. 
     
     
         168 . An electrode lead, comprising:
 a flexible circuit, comprising:
 a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on the other end of the lead substrate portion; 
 an electrically conductive trace extending from the connector substrate portion to the electrode carrying substrate portion; 
 a first window formed in the connector substrate portion to expose the electrically conductive trace to form a connector pad; and 
 a second window formed in the electrode carrying substrate portion to expose the electrically conductive trace to form an electrode pad; and 
   a rigid cylindrical rod having an outer surface on which the connector substrate portion is affixed, such that the connector pad faces outward away from the cylindrical rod to form a lead connector contact.   
     
     
         169 . The electrode lead of  claim 168 , wherein the connector substrate portion is pre-shaped to conform to the outer surface of the cylindrical rod. 
     
     
         170 . The electrode lead of  claim 168 , wherein the electrode carrying substrate portion is an enlarged cuff substrate portion pre-shaped into a cuff sized for being circumferentially disposed around a nerve. 
     
     
         171 . The electrode lead of  claim 170 , wherein the cuff substrate portion is rectangular. 
     
     
         172 . The electrode lead of  claim 170 , wherein the electrode pad is configured for facing a nerve when the cuff substrate portion is circumferentially disposed around a nerve. 
     
     
         173 . The electrode lead of  claim 168 , wherein the electrode carrying substrate portion is an enlarged paddle substrate portion. 
     
     
         174 . The electrode lead of  claim 168 , further comprising an outer layer of insulative material disposed over the planar dielectric substrate, the insulative material composed of one of silicone, polyurethane, polyether polyurethane, polycarbonate polyurethane, parylene, perfluoroalkoxy alkanes (PFA), and polytetrafluoroethylene (PTFE). 
     
     
         175 . The electrode lead of  claim 168 , wherein the planar dielectric substrate is composed of liquid crystal polymer (LCP). 
     
     
         176 . A lead connector, comprising:
 a planar dielectric connector substrate;   a rigid cylindrical rod having an outer surface on which the connector substrate is affixed; and   at least one connector pad carried by the connector substrate, the at least one connector pad facing outward away from the cylindrical rod to form a lead connector contact.   
     
     
         177 . The lead connector of  claim 176 , wherein the connector substrate is pre-shaped to conform to the outer surface of the cylindrical rod. 
     
     
         178 . The lead connector of  claim 176 , further comprising:
 at least one electrically conductive trace disposed within the connector substrate; and   at least one window formed in the connector substrate to expose the at least one electrically conductive trace to form the at least one connector pad.   
     
     
         179 . The lead connector of  claim 176 , wherein the connector substrate is composed of liquid crystal polymer (LCP). 
     
     
         180 . The lead connector of  claim 176 , wherein the lead connector is configured for being inserted into a corresponding connector of a neurostimulator. 
     
     
         181 .- 256 . (canceled)