Friction burnish for alloy plating

Abstract

A plating method for plating a layer of material onto a part using friction burnishing is provided. The method includes moving the part at a predetermined speed. The method further includes bringing the material into contact with the moving part at a predetermined pressure. The method further includes forming a plating layer of the material on a surface of the part by maintaining the material in contact with the moving part for a predetermined time period. Alternatively, the method includes forming at least one lobed plating layer of the material on the moving part by maintaining the material in contact with the moving part and switching between a first predetermined pressure and a second predetermined pressure.

1 . A plating method for plating a layer of material onto a part, the method comprising:
 moving the part at a predetermined speed;   bringing the material into contact with the moving part at a predetermined pressure; and   forming a plating layer of the material on a surface of the part by friction burnishing the material in contact with the moving part for a predetermined time period.   
     
     
         2 . The plating method of  claim 1 , wherein the part is a steel pin. 
     
     
         3 . The plating method of  claim 1 , wherein the material includes at least one of chromium and nickel. 
     
     
         4 . The plating method of  claim 1 , wherein the material includes boron. 
     
     
         5 . The plating method of  claim 1 , wherein the material includes aluminum. 
     
     
         6 . The plating method of  claim 5 , wherein
 the part comprises steel,   forming the plating layer includes forming a diffusion layer of aluminum below the surface of the steel part, and   the method further comprising subjecting the steel part having the plating layer to a nitriding heat treatment.   
     
     
         7 . The plating method of  claim 1 , wherein the material includes at least one of copper, zinc, and tin. 
     
     
         8 . The plating method of  claim 1 , further comprising subjecting the part having the plating layer formed thereon to a heat treatment. 
     
     
         9 . The plating method of  claim 1 , wherein forming the plating layer includes forming a diffusion layer of the material below the surface of the part. 
     
     
         10 . A plating method for plating a layer of a first material and a second material onto a part, the method comprising:
 moving the part at a predetermined speed;   bringing the first material into contact with the moving part at a predetermined pressure;   bringing the second material into contact with the moving part at a predetermined pressure; and   forming at least one plating layer of the first material and the second material on a surface of the part by friction burnishing the first material and the second material in contact with the moving part for a predetermined time period.   
     
     
         11 . The plating method of  claim 10 , wherein the first material and the second material have the same composition. 
     
     
         12 . The plating method of  claim 10 , wherein the first material and the second material have different compositions. 
     
     
         13 . The plating method of  claim 12 , wherein
 the first material and the second material are brought into contact with the part simultaneously, and   the at least one plating layer includes a layer comprising the first material and the second material.   
     
     
         14 . The plating method of  claim 10 , wherein
 the second material is brought into contact with the moving part when the first material is not in contact with the moving part, and   the at least one plating layer includes a layer comprising the second material and not the first material.   
     
     
         15 . The plating method of  claim 10 , wherein the predetermined speed, the predetermined pressure, and the predetermined time are selected based on a desired chemical composition and thickness of the at least one plating layer. 
     
     
         16 . (canceled) 
     
     
         17 . A plating method for plating a layer of a material onto a part, the method comprising:
 moving the part at a predetermined speed;   bringing the material into contact with a first portion of a circumference of the moving part at a first predetermined pressure;   bringing the material into contact with a second portion of the circumference of the moving part at a second predetermined pressure; and   forming at least one lobed plating layer of the material on the moving part by friction burnishing the material in contact with the moving part and switching between the first predetermined pressure and the second predetermined pressure.   
     
     
         18 . The plating method according to  claim 17 , further comprising forming a lobed structure on the part by forming the at least one plating layer of the material on the first portion of the moving part.