Fog Bonding Device and Method Thereof

Abstract

A bonding device and bonding method for bonding an FPC film on a display panel through an anisotropic conductor attached to the display panel, the device including a panel supporting unit configured to support the display panel; a heating and pressurizing unit disposed on an upper area of the panel supporting unit and configured to pressurize and heat a compression area of the FPC film placed on an upper part of the anisotropic conductor towards the display panel, a film supporting unit disposed adjacent the panel supporting unit and configured to support the FPC film, and a film pre-heating unit provided in the film supporting unit and configured to pre-heat the FPC film.

What is claimed is: 
     
         1 . A bonding device for bonding an FPC film on a display panel through an anisotropic conductor attached to the display panel, the device comprising:
 a panel supporting unit configured to support the display panel;   a heating and pressurizing unit disposed on an upper area of the panel supporting unit and configured to pressurize and heat a compression area of the FPC film placed on an upper part of the anisotropic conductor towards the display panel;   a film supporting unit disposed adjacent the panel supporting unit and configured to support the FPC film;   a film pre-heating unit provided in the film supporting unit and configured to pre-heat a non-compression area of the FPC film mounted on the film supporting unit;   wherein the heating and pressurizing unit compresses the FPC film by heating and pressurizing the compression area of the FPC film; and   wherein a dummy lead and a real lead are provided on the FPC film, the real lead extends from the compression area to the non-compression area, the dummy lead does not extend from the compression area to the non-compression area, and the real lead is only pre-heated during the pre-heating by the pre-heating unit.   
     
     
         2 . The device according to  claim 1 , wherein the film pre-heating unit comprises:
 a heating unit; and   a pre-heating temperature adjustment unit configured to adjust a heating temperature of the heating unit.   
     
     
         3 . The device according to  claim 1 , wherein a pre-heating temperature of the film pre-heating unit is lower than a heating temperature of the heating and pressurizing unit. 
     
     
         4 . The device according to  claim 2 , wherein a pre-heating temperature of the film pre-heating unit is lower than a heating temperature of the heating and pressurizing unit.