Semiconductor module

Abstract

Reliability of a semiconductor device is improved. A third semiconductor chip on which a control circuit is formed, and a first semiconductor chip of a plurality of IGBT chips are electrically connected via a high-side relay board. That is, the first semiconductor chip and the third semiconductor chip are electrically connected via a first wire, a high-side relay board and a second wire. Similarly, the third semiconductor chip on which the control circuit is formed and a second semiconductor chip of a plurality of IGBT chips are electrically connected via a low-side relay board. That is, the second semiconductor chip and the third semiconductor chip are electrically connected via the first wire, the low-side relay board and the second wire.

What is claimed is: 
     
         1 . A semiconductor device comprising:
 a sealing body comprised of a quadrangle in plan view;   a first lead group arranged along a first side of the sealing body in plan view;   a second lead group arranged along a second side of the sealing body facing the first side in plan view;   a first component mounting portion arranged between the first lead group and the second lead group in plan view;   a plurality of second component mounting portions arranged between the first lead group and the second lead group, and arranged between the first component mounting portion and the second lead group in plan view;   a first electronic component sealed with the sealing body, and mounted on the first component mounting portion;   a substrate sealed with the sealing body, mounted on the first component mounting portion, and arranged adjacent to the first electronic component in plan view; and   a plurality of second electronic components sealed with the sealing body, and respectively mounted on the plurality of second component mounting portions,   wherein the plurality of second electronic components are arranged along the second side of the sealing body,   wherein the first electronic component and a part of the first lead group are electrically connected with each other,   wherein the first electronic component and each of the plurality of second electronic components are electrically connected with each other,   wherein the second electronic component and a part of the second lead group are electrically connected with each other, and   wherein the first electronic component and a part of the plurality of second electronic components are electrically connected with each other via a first wire coupling the first electronic component and the substrate, the substrate and a second wire coupling the substrate and the part of the plurality of second electronic components.