Substrate comprising a stack having thermal properties
Abstract
The invention relates to a substrate ( 10 ), especially a transparent glass substrate, provided with a thin-film multilayer comprising a functional layer ( 40 ) having reflection properties in the infrared and/or in solar radiation, especially a metallic functional layer based on silver or on a metal alloy containing silver, and two coatings ( 20, 60 ), said coatings being composed of a plurality of dielectric layers ( 24, 26; 64 ), so that the functional layer ( 40 ) is placed between the two coatings ( 20, 60 ), the functional layer ( 40 ) being deposited on a wetting layer ( 30 ) itself deposited directly onto a subjacent coating ( 20 ), characterized in that the subjacent coating ( 20 ) comprises at least one dielectric layer ( 24 ) based on nitride, especially on silicon nitride and/or aluminum nitride, and at least one noncrystalline smoothing layer ( 26 ) made from a mixed oxide, said smoothing layer ( 26 ) being in contact with said superjacent wetting layer ( 30 ).
Claims
exact text as granted — not AI-modified1 . A substrate provided with a thin-film multilayer comprising, in the following order from the substrate:
a subjacent coating comprising a plurality of dielectric layers comprising:
a dielectric layer based on a nitride; and
a noncrystalline smoothing layer based on a mixed oxide;
a wetting layer; a functional layer having reflection properties in the infrared and/or in solar radiation; and a second coating comprising a plurality of dielectric layers wherein the smoothing layer is in contact with the wetting layer.
2 . The substrate of claim 1 , wherein the smoothing layer is a mixed oxide layer based on an oxide of at least one metal selected from the group consisting of Sn, Si, Ti, Zr, Hf, Zn, Ga, and In.
3 . The substrate of claim 2 , wherein the smoothing layer is a layer of a mixed oxide based on zinc and tin, optionally doped, or a layer of a mixed indium tin oxide (ITO) deposited at low temperature.
4 . The substrate of claim 1 , wherein the smoothing layer is an oxide layer having a nonstoichiometric amount of oxygen.
5 . The substrate of claim 1 , wherein the smoothing layer has a geometric thickness between 0.1 and 30 nm.
6 . The substrate of claim 1 , wherein the smoothing layer has a geometric thickness between 0.2 and 10 nm.
7 . The substrate of claim 1 , wherein the thin film multilayer further comprises a subjacent blocking coating, wherein the functional layer is placed directly onto the subjacent blocking coating.
8 . The substrate of claim 1 , wherein the thin film multilayer further comprises a superjacent blocking coating, wherein the functional layer is placed directly under the superjacent blocking coating.
9 . The substrate of claim 1 , wherein the thin film multilayer further comprises a subjacent blocking coating and a superjacent blocking coating, wherein the functional layer is placed directly onto the subjacent blocking coating and directly under the superjacent blocking coating.
10 . The substrate of claim 7 , wherein the subjacent blocking coating is based on Ni or Ti.
11 . The substrate of claim 7 , wherein the subjacent blocking coating is based on a Ni alloy.
12 . The substrate of claim 8 , wherein the superjacent blocking coating is based on Ni or Ti.
13 . The substrate of claim 8 , wherein the subjacent blocking coating is based on a Ni alloy.
14 . The substrate of claim 1 , wherein the wetting layer is based on zinc oxide.
15 . The substrate of claim 1 , wherein dielectric layer based on a nitride in the subjacent coating is based on silicon nitride and/or aluminum nitride.
16 . The substrate of claim 1 , wherein the functional layer is a metallic functional layer based on silver or on a metal alloy comprising silver.
17 . A glazing unit, comprising:
the substrate of claim 1 ; and optionally, at least one other substrate.
18 . The glazing unit of claim 17 , mounted in monolithic form or as multiple glazing of a double glazing or laminated glazing type, wherein at least the substrate carrying the multilayer is curved or toughened.
19 . A process for manufacturing the substrate of claim 1 , the process comprising:
depositing the thin film multilayer on the substrate by a vacuum sputtering technique, optionally magnetron sputtering; and then carrying out a heat treatment of bending, toughening or annealing on the substrate without degrading its optical and/or mechanical quality.Cited by (0)
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