Heat dissipation element with heat resistant mechanism

Abstract

A heat dissipation element with a heat resistant mechanism is provided. The heat dissipation element is a heat pipe, a loop-type heat pipe or a vapor chamber. A heat resistant layer is properly formed on an inner side or an outer side of the heat dissipation element. Consequently, while the heat is transferred, the tactile temperature of the handheld electronic device is not influenced.

What is claimed is: 
     
         1 . A heat pipe, comprising:
 a pipe body comprising an evaporation section, a heat resistant section and a condensation section, wherein the heat resistant section is arranged between the evaporation section and the condensation section;   a capillary structure disposed within the pipe body; and   a heat resistant layer disposed within the pipe body and located at the heat resistant section.   
     
     
         2 . The heat pipe according to  claim 1 , wherein the capillary structure is arranged between the pipe body and the heat resistant layer. 
     
     
         3 . The heat pipe according to  claim 1 , wherein the capillary structure is a fiber bundle. 
     
     
         4 . The heat pipe according to  claim 1 , wherein the capillary structure is a fiber bundle, wherein the heat resistant layer is located beside the fiber bundle, and the heat resistant layer and the fiber bundle are not overlapped with each other. 
     
     
         5 . A heat pipe in contact with a heat generation element, the heat pipe comprising:
 a pipe body comprising an evaporation section and a condensation section;   a capillary structure disposed within the pipe body; and   a heat resistant layer disposed within the pipe body, wherein the pipe body has a far side away from the heat generation element, and the heat resistant layer is located at the far side of the pipe body.   
     
     
         6 . The heat pipe according to  claim 5 , wherein the heat resistant layer is formed on an inner side of the capillary structure. 
     
     
         7 . The heat pipe according to  claim 5 , wherein the heat resistant layer is located at the evaporation section or the condensation section of the pipe body. 
     
     
         8 . A loop-type heat pipe in contact with a heat generation element, the loop-type heat pipe comprising:
 a top plate; and   a bottom plate in contact with the heat generation element, wherein the top plate and the bottom plate are stacked on each other to define an evaporation section, a vapor channel, a condensation section and a liquid channel, wherein a thermal conductivity of the bottom plate is higher than a thermal conductivity of the top plate.   
     
     
         9 . A loop-type heat pipe in contact with a heat generation element, the loop-type heat pipe comprising:
 a top plate;   a bottom plate in contact with the heat generation element, wherein the top plate and the bottom plate are stacked on each other to define an evaporation section and a condensation section, wherein a thermal conductivity of the bottom plate is higher than a thermal conductivity of the top plate;   a vapor channel connected with the evaporation section and the condensation section; and   a liquid channel connected with the condensation section and the evaporation section.   
     
     
         10 . A vapor chamber in contact with a heat generation element, the vapor chamber comprising:
 a top thin plate; and   a bottom thin plate in contact with the heat generation element, wherein a thermal conductivity of the bottom thin plate is higher than a thermal conductivity of the top thin plate.   
     
     
         11 . A vapor chamber in contact with a heat generation element, the vapor chamber comprising:
 a top thin plate; and   a bottom thin plate in contact with the heat generation element; and   a heat resistant layer formed on an inner side of the top thin plate.