Optical fingerprint sensor module and package thereof

Abstract

The present invention provides an optical fingerprint sensor module and its package thereof, which comprises a carrier, at least one light emitting diode, at least one image sensor and a molding compound. When a user's fingerprint is generated for recognition, the light emitting diode provides enough light sources for lighting and helping the image sensor to capture and sense an image of the fingerprint. A top emitting surface of the light emitting diode is higher than a top of the image sensor, such that interferences from the side light of the light emitting diode with the image sensor can be effectively avoided. Besides, the molding compound comprises a caved portion corresponding to the image sensor on a vertical plane. By designing above, it successfully achieves the purpose of reducing a thickness of the optical fingerprint sensor package.

What is claimed is: 
     
         1 . An optical fingerprint sensor module, comprising:
 a carrier;   at least one light emitted diode, which is disposed on said carrier for providing at least one light source; and   at least one image sensor disposed on said carrier and being electrically connected with said carrier, wherein when a user's fingerprint is generated for recognition, said at least one light source is provided for lighting and helping said image sensor to capture and sense an image of said fingerprint, and a top emitting surface of said light emitted diode is higher than a top of said at least one image sensor.   
     
     
         2 . The optical fingerprint sensor module of  claim 1 , further comprising at least one lead frame, wherein said at least one lead frame is disposed on said carrier, and said at least one light emitting diode is disposed on said at least one lead frame, such that said top emitting surface of said light emitted diode is higher than said top of said at least one image sensor. 
     
     
         3 . The optical fingerprint sensor module of  claim 2 , further comprising a plurality of pads, which are in connection with said carrier and said at least one image sensor. 
     
     
         4 . The optical fingerprint sensor module of  claim 3 , further comprising at least one electrical bump, which is in connection with said lead frame and said at least one light emitting diode. 
     
     
         5 . The optical fingerprint sensor module of  claim 4 , wherein said at least one light emitting diode is flip-chip mounted upon said carrier through said at least one electrical bump and said at least one lead frame. 
     
     
         6 . The optical fingerprint sensor module of  claim 1 , wherein said carrier further comprises at least one protruding part, and said at least one light emitting diode is disposed on said at least one protruding part such that said top emitting surface of said light emitted diode is higher than said top of said at least one image sensor. 
     
     
         7 . The optical fingerprint sensor module of  claim 6 , further comprising a plurality of pads, which are in connection with said carrier and said at least one image sensor. 
     
     
         8 . The optical fingerprint sensor module of  claim 7 , further comprising at least one electrical bump, which is in connection with said protruding part of said carrier and said at least one light emitting diode. 
     
     
         9 . The optical fingerprint sensor module of  claim 8 , wherein said at least one light emitting diode is flip-chip mounted upon said carrier through said at least one electrical bump and said protruding part. 
     
     
         10 . The optical fingerprint sensor module of  claim 1 , wherein said carrier is a substrate or a lead frame. 
     
     
         11 . The optical fingerprint sensor module of  claim 1 , further comprising a molding compound, covering said carrier, said light emitting diode and said image sensor, wherein said molding compound comprises a caved portion which is corresponding to said image sensor such that a thickness of a first structure composed of said carrier, said image sensor and said molding compound is thinner than that of a second structure composed of said carrier, said light emitting diode and said molding compound. 
     
     
         12 . The optical fingerprint sensor module of  claim 11 , wherein said molding compound is made of light transparent material. 
     
     
         13 . An optical fingerprint sensor package, comprising:
 a carrier;   at least one light emitted diode, which is disposed on said carrier for providing at least one light source;   at least one image sensor disposed on said carrier and being electrically connected with said carrier, wherein when a user's fingerprint is generated for recognition, said at least one light source is provided for lighting and helping said image sensor to capture and sense an image of said fingerprint, and a top emitting surface of said light emitted diode is higher than a top of said at least one image sensor; and   a molding compound, covering said carrier, said at least one light emitting diode and said at least one image sensor, wherein said molding compound comprises a caved portion which is corresponding to said at least one image sensor such that a thickness of a first structure composed of said carrier, said at least one mage sensor and said molding compound is thinner than that of a second structure composed of said carrier, said at least one light emitting diode and said molding compound.   
     
     
         14 . The optical fingerprint sensor package of  claim 13 , wherein said molding compound is made of light transparent material. 
     
     
         15 . The optical fingerprint sensor package of  claim 13 , further comprising at least one lead frame, wherein said at least one lead frame is disposed on said carrier, and said at least one light emitting diode is disposed on said at least one lead frame, such that said top emitting surface of said light emitted diode is higher than said top of said at least one image sensor. 
     
     
         16 . The optical fingerprint sensor package of  claim 15 , further comprising at least one electrical bump, which is in connection with said lead frame and said at least one light emitting diode. 
     
     
         17 . The optical fingerprint sensor package of  claim 16 , wherein said at least one light emitting diode is flip-chip mounted upon said carrier through said at least one electrical bump and said at least one lead frame. 
     
     
         18 . The optical fingerprint sensor package of  claim 13 , wherein said carrier further comprises at least one protruding part, and said at least one light emitting diode is disposed on said at least one protruding part such that said top emitting surface of said light emitted diode is higher than said top of said at least one image sensor. 
     
     
         19 . The optical fingerprint sensor package of  claim 18 , further comprising at least one electrical bump, which is in connection with said protruding part of said carrier and said at least one light emitting diode. 
     
     
         20 . The optical fingerprint sensor package of  claim 19 , wherein said at least one light emitting diode is flip-chip mounted upon said carrier through said at least one electrical bump and said protruding part. 
     
     
         21 . The optical fingerprint sensor package of  claim 13 , wherein said carrier is a substrate or a lead frame.