Optical fingerprint sensor package

Abstract

An optical fingerprint sensor package includes a carrier, an image sensor, at least one LED (light emitting diode), and a molding compound. The carrier is penetrated with a first cavity. The carrier has a peripheral region surrounding the first cavity. The peripheral region is provided with first conductive pads thereon. The image sensor is mounted in the first cavity and electrically connected to the first conductive pads by conductive wire bonding. The LED is mounted to correspond to the peripheral region of the carrier. The molding compound covers the peripheral region of the carrier, the image sensor, and the at least one LED, and fills the first cavity to fix the image sensor in the first cavity and expose the bottom of the image sensor to an external space.

What is claimed is: 
     
         1 . An optical fingerprint recognition sensor package comprising:
 a carrier penetrated with a first cavity, the carrier having a peripheral region surrounding the first cavity, the peripheral region is provided with first conductive pads thereon;   an image sensor mounted in the first cavity and electrically connected to the first conductive pads by conductive wire bonding;   at least one LED (light emitting diode) mounted to correspond to the peripheral region of the carrier; and   a molding compound covering the peripheral region of the carrier, the image sensor, and the at least one LED, and filling the first cavity to fix the image sensor in the first cavity and expose a bottom of the image sensor to an external space.   
     
     
         2 . The optical fingerprint sensor package according to  claim 1 , wherein the at least one LED is mounted on the peripheral region of the carrier through an adhesive by surface-mount technology (SMT). 
     
     
         3 . The optical fingerprint sensor package according to  claim 2 , wherein the adhesive is a red glue or a silver paste. 
     
     
         4 . The optical fingerprint sensor package according to  claim 2 , wherein a height of a bottom of the at least one LED is higher than a height of a top of the image sensor. 
     
     
         5 . The optical fingerprint sensor package according to  claim 1 , wherein the peripheral region of the carrier is further provided with second conductive pads thereon and penetrated with at least one second cavity, the at least one LED is mounted in the at least one second cavity of the peripheral region, the molding compound fills the at least one second cavity to fix the at least one LED in the at least one second cavity and expose a bottom of the at least one LED to the external space, and the at least one LED is electrically connected to the second conductive pads by conductive wire bonding. 
     
     
         6 . The optical fingerprint sensor package according to  claim 5 , wherein the at least one second cavity further comprises a plurality of second cavities, and the at least one LED further comprises a plurality of LEDs (light emitting diodes) respectively mounted in the plurality of second cavities. 
     
     
         7 . The optical fingerprint sensor package according to  claim 5 , wherein a height of a top of the carrier is higher than a height of a top of the at least one LED. 
     
     
         8 . The optical fingerprint sensor package according to  claim 1 , wherein the carrier is a substrate or a lead frame. 
     
     
         9 . The optical fingerprint sensor package according to  claim 1 , wherein the at least one LED comprises a plurality of LEDs (light emitting diodes). 
     
     
         10 . The optical fingerprint sensor package according to  claim 1 , wherein the at least one LED is an infrared (IR) LED. 
     
     
         11 . The optical fingerprint sensor package according to  claim 1 , wherein the image sensor is a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS).