Systems and methods for flexible components for powered cards and devices

Abstract

Die may be thinned using a thinning and/or a polishing process. Such thinned die may be flexible and may change operational characteristics when flexed. The flexible die may be applied to a mechanical carrier (e.g., a PCB) of a card or device. Detection circuitry may also be provided on the PCB and may be used to detect changed operational characteristics. Such detection circuitry may cause a reaction to the changed characteristics by controlling other components on the card or device based upon the flex-induced changed characteristics. The thinned die may be stacked, interconnected, and encapsulated between sheets of laminate material to form a flexible card or device.

1 - 3 . (canceled) 
     
     
         4 . A method of making a device, comprising:
 reducing a thickness of two or more die;   stacking said two or more die onto a PCB;   encapsulating said die between sheets of a laminate material; and   hardening said encapsulation to form said device.   
     
     
         5 . (canceled) 
     
     
         6 . The method of  claim 4 , wherein:
 a thickness of each of said two or more die is between approximately 0.003 inches and 0.005 inches.   
     
     
         7 . The method of  claim 4 , wherein:
 a thickness of each of said two or more die is approximately 0.004 inches.