High speed communication jack

Abstract

A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias.

1 . A high speed communication jack comprising: a housing including a port configured to receive a plug; a plurality of contacts disposed within the port, wherein each contact is configured to engage and couple a corresponding signal line in the plug; and a circuit board disposed in the housing having a substrate including a plurality of layers, wherein a surface of each layer includes a grounding portion defined by a conductive material layer disposed on the surface of the layer excluding an area around any pin vias formed in the layer and any traces disposed on the surface of the layer, and a plurality of grounding vias formed in the grounding portion of each layer and extending through the substrate, wherein each grounding via includes a conductive material therein to connect a grounding plane formed on a bottom surface of the substrate with the grounding portion of each of the layers. 
     
     
         2 . The high speed communication jack of  claim 1 , wherein the substrate is rigid. 
     
     
         3 . The high speed communication jack of  claim 1 , wherein the substrate is disposed as a lower surface of the housing. 
     
     
         4 . The high speed communication jack of  claim 1 , wherein the pin vias are concentrically aligned in registration. 
     
     
         5 . The high speed communication jack of  claim 4 , wherein a plurality of pins disposed in the pin vias extend from the substrate and are configured to engage a printed circuit board. 
     
     
         6 . The high speed communication jack of  claim 1 , wherein each of the layers is separated from an adjacent layer by a layer formed of a non-conducting material. 
     
     
         7 . The high speed communication jack of  claim 6 , wherein the non-conducting material is Rogers R04003 material. 
     
     
         8 . The high speed communication jack of  claim 6 , wherein the non-conducting material is an adhesive material. 
     
     
         9 . The high speed communication jack of  claim 1 , wherein the grounding plane is configured to engage a printed circuit board to ground the jack to the printed circuit board. 
     
     
         10 . A high speed communication jack comprising: a standard RJ45 housing including a port configured to receive a plug; a plurality of contacts disposed within the port, each contact configured to engage and couple a corresponding signal line in the plug; and a circuit board disposed in the housing having a substrate including a plurality of layers, wherein a surface of each layer includes a grounding portion defined by a conductive material layer disposed on the surface of the layer excluding an area around any pin vias formed in the layer and traces disposed on the surface of the layer, and a plurality of grounding vias formed in the grounding portion of each layer and extending through the substrate, wherein each grounding via includes a conductive material therein to connect a grounding plane formed on a bottom surface of the substrate with the grounding portion of each of the layers. 
     
     
         11 . The high speed communication jack of  claim 10 , wherein the substrate is rigid. 
     
     
         12 . The high speed communication jack of  claim 10 , wherein the substrate is disposed as a lower surface of the housing. 
     
     
         13 . The high speed communication jack of  claim 10 , wherein the pin vias are concentrically aligned in registration. 
     
     
         14 . The high speed communication jack of  claim 13 , wherein a plurality of pins disposed in the pin vias extend from the substrate and are configured to engage a printed circuit board. 
     
     
         15 . The high speed communication jack of  claim 10 , wherein each of the layers is separated from an adjacent layer by a layer formed of a non-conducting material. 
     
     
         16 . The high speed communication jack of  claim 15 , wherein the non-conducting material is Rogers R04003 material. 
     
     
         17 . The high speed communication jack of  claim 15 , wherein the non-conducting material is an adhesive material. 
     
     
         18 . The high speed communication jack of  claim 10 , wherein the grounding plane is configured to engage a printed circuit board to ground the jack to the printed circuit board. 
     
     
         19 . A high speed communication jack comprising: a housing including a port configured to receive a plug; a plurality of contacts disposed within the port, wherein each contact is configured to engage and couple a corresponding signal line in the plug; and a circuit board disposed in the housing having a substrate including a plurality of layers, wherein the plurality of layers includes a top layer, a bottom layer and a pair of intermediate layers disposed between the top and bottom layers, wherein the top and bottom layers each have a grounding portion defined by a conductive material layer disposed on a surface of the respective top and bottom layers excluding an area around any pin vias formed therein, wherein each of the intermediate layers has a grounding portion defined by a conductive material layer disposed on a surface of the respective intermediate layer excluding an area around any pin vias formed therein and traces disposed thereon, wherein a plurality of differentially balanced pairs of the traces are defined by one trace formed on one of the intermediate layers and an other trace formed on an other of the intermediate layers, and a plurality of grounding vias formed in the grounding portion of each layer and extending through the substrate, wherein each grounding via includes a conductive material therein to connect a grounding plane formed on a bottom surface of the substrate with the grounding portion of each of the layers. 
     
     
         20 . A high speed communication jack comprising: a standard RJ45 housing including a port configured to receive a plug; a plurality of contacts disposed within the port, wherein each contact is configured to engage and couple a corresponding signal line in the plug; and a circuit board disposed in the housing having a substrate including a plurality of layers, wherein the plurality of layers includes a top layer, a bottom layer and a pair of intermediate layers disposed between the top and bottom layers, wherein the top and bottom layers each have a grounding portion defined by a conductive material layer disposed on a surface of the respective top and bottom layers excluding an area around any pin vias formed therein, wherein each of the intermediate layers has a grounding portion defined by a conductive material layer disposed on a surface of the respective intermediate layer excluding an area around any pin vias formed therein and traces disposed thereon, wherein a plurality of differentially balanced pairs of the traces are defined by one trace formed on one of the intermediate layers and an other trace formed on an other of the intermediate layers, and a plurality of grounding vias formed in the grounding portion of each layer and extending through the substrate, wherein each grounding via includes a conductive material therein to connect a grounding plane formed on a bottom surface of the substrate with the grounding portion of each of the layers.