Electroless plating method

Abstract

A method of the present invention for performing an electroless plating on a substrate comprising the steps of: (a) putting the substrate in contact with a composition containing a compound represented by the following general formula (1): wherein R 1 is an alkyl group having 8 to 20 carbon atoms or an aryl group having 5 to 14 carbon atoms, the alkyl group or the aryl group may be substituted by a hydroxyl group, a carboxyl group, a halogen or an alkyl group having 1 to 4 carbon atoms. R 2 , R 3 , and R 4 are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, the alkyl group may be substituted by a hydroxyl group, a carboxyl group or a halogen, wherein at least one of R 2 , R 3 , and R 4 may be bonded with R 1 to form a ring, X is a counter anion); (b) putting the substrate in contact with a catalyst composition, and (c) putting the substrate in contact with an electroless plating composition.

What is claimed is: 
     
         1 . A method for performing an electroless plating on a substrate comprising the steps of:
 (a) putting the substrate in contact with a composition containing a compound represented by the following general formula (1):   
       
         
           
           
               
               
           
         
       
       wherein R 1  is an alkyl group having 8 to 20 carbon atoms or an aryl group having 5 to 14 carbon atoms, the alkyl group or the aryl group may be substituted with a hydroxyl group, a carboxyl group, a halogen or an alkyl group having 1 to 4 carbon atoms, wherein if R 1  is an aryl group, the total number of carbon atoms of the aryl group and its substituent is not less than 6. R 2 , R 3 , and R 4  are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, the alkyl group of R 2 , R 3 , and R 4  may be substituted by a hydroxyl group, a carboxyl group, or a halogen, wherein at least one of R 2 , R 3 , and R 4  may be bonded with R 1  to form a ring that may contain one or more hetero atoms and may be substituted by a hydroxyl group, a carboxyl group, a halogen or an alkyl group having 1 to 4 carbon atoms, the total number of carbon atoms of the ring and its substituent is not less than 8, X is a counter anion, and having a molecular weight not greater than 500, or a compound represented by the following general formula (2): 
       
         
           
           
               
               
           
         
       
       wherein R 5  is an alkyl group having 8 to 20 carbon atoms, the alkyl group may be substituted by a hydroxyl group, a carboxyl group, a halogen or an alkyl group having 1 to 4 carbon atoms, R 6  and R 7  are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, Y is a halogen, and having a molecular weight not greater than 500;
 (b) putting the substrate in contact with a catalyst composition; and 
 (c) putting the substrate in contact with an electroless plating composition. 
 
     
     
         2 . The method according to  claim 1 , wherein the content of the compound, represented by general formula (1) or (2), in the composition is from 0.1 to 10 g/L. 
     
     
         3 . The method according to  claim 1 , wherein the electroless plating is electroless copper plating. 
     
     
         4 . A substrate having a metal film on at least a part of its surface obtained by the method according to  claim 1 .