Method for electroless plating

Abstract

To provide a conditioner having less foaming property and having adhesion higher than the conventional conditioner using a cationic polymer or the like and, and an electroless plating method using the same. A method of the present invention for performing an electroless plating including the steps of: (a) putting the substrate in contact with a composition containing a compound represented by the following general formula (1) H 2 N—R 1 —NH—R 2 —NH 2   (1) wherein, R 1 and R 2 are each independently an alkylene group having 3 to 10 carbon atoms; (b) putting the substrate in contact with a catalyst composition; and (c) putting the substrate in contact with an electroless plating composition.

What is claimed is: 
     
         1 . A method for performing an electroless plating on a substrate comprising the steps of:
 (a) putting the substrate in contact with a composition containing a compound represented by the following general formula (1)
   H 2 N—R 1 —NH—R 2 —NH 2   (1)
 
   wherein, R 1  and R 2  are each independently an alkylene group having 3 to 10 carbon atoms;   (b) putting the substrate in contact with a catalyst composition; and   (c) putting the substrate in contact with an electroless plating composition.   
     
     
         2 . The method according to  claim 1 , wherein the content of the compound, represented by general formula (1), in the composition is from 0.1 to 10 g/L. 
     
     
         3 . The method according to  claim 1  or  2 , wherein the electroless plating is electroless copper plating. 
     
     
         4 . A substrate having a metal film on at least a part of its surface obtained by the method according to  claim 1 .