Photosensitive pixel structure with front side coating

Abstract

The present invention refers to a photosensitive pixel structure ( 10 ) comprising a substrate layer ( 1 5 ) and an interface layer ( 50 ), wherein the interface layer ( 50 ) is provided at least partially on a first surface of the substrate layer ( 15 ) and wherein the interface layer ( 50 ) at least partially comprises a first material layer ( 51 ) and the interface layer ( 50 ) at least partially comprises a second material layer ( 52 ) covering the first material layer ( 51 ), such that the first material layer ( 51 ) is at least partially sandwiched between the second material layer ( 52 ) and the substrate ( 15 ). The invention further refers to an array and an implant comprising such a pixel structure as well as a method to provide a pixel structure, wherein further the second material layer comprises a thickness chosen from the range of 200 nm-600 nm, preferably from the range of 300 nm-500 nm, most preferably from the range of 320 nm-450 nm.

1 . An hermetic housing that is configured to be implanted in a body of an animal or a human patient, the housing comprising:
 a base part;   a cover part configured to cover the base part; and   a connecting means, provided at an interface between the base part and the cover part, wherein the base part ( 50 ) comprises a first hermetic material and the cover part comprises a second hermetic material,   wherein the connecting means comprises a third hermetic material, adapted to hermetically seal an interior of the hermetic housing from an outside of the hermetic housing.   
     
     
         2 . The hermetic housing according to  claim 1 , wherein the cover part comprises a material, which is transparent to at least a predetermined wavelength or wavelength range, and wherein the material is a metal-free material. 
     
     
         3 . The hermetic housing according to  claim 1 , wherein the base part comprises a ceramic material. 
     
     
         4 . The hermetic housing according to  claim 1 , wherein the connecting means comprises a metal-free solder paste. 
     
     
         5 . The hermetic housing according to  claim 4 , wherein the cover part comprises a material that is transparent to a predetermined wavelength or wavelength range, wherein the solder paste is light absorbent for the predetermined wavelength or wavelength range, or wherein the solder paste is light-absorbent at least for one wavelength or a part of theft wavelength range, for which the cover part of the hermetic housing is transparent. 
     
     
         6 . An electronics package for an implant device, the electronics package comprising
 at least one receiving unit;   an electrical circuit adapted to generate a stimulating signal; and   a first hermetic housing,   wherein the first hermetic housing comprises:
 a base part adapted to receive the electrical circuit and/or the at least one receiving unit; 
 a cover part, adapted to cover the base part; and 
 a connecting means, provided between the base part and the cover part, adapted to connect the base part and the cover part and to hermetically seal an interior of the hermetic housing from an exterior of the hermetic housing. 
   
     
     
         7 . The electronics package according to  claim 6 , wherein the electronics package comprises a second hermetic housing arranged at least partially around the first hermetic housing. 
     
     
         8 . The electronics package according to  claim 6 , wherein at least one transmitting and/or receiving unit is provided outside the first hermetic housing and inside the second hermetic housing. 
     
     
         9 . The electronics package according to  claim 6 , wherein the second hermetic housing comprises a biocompatible material that includes silicone. 
     
     
         10 . The electronics package according to  claim 6 , wherein the base part comprises a bottom part, the bottom part comprising a stack of layers, wherein at least one of the layers in the stack of layers comprises an integrated electrical circuit. 
     
     
         11 . A prosthesis system comprising:
 a first implantable device comprising an electronics package, the electronics package comprising:
 at least one receiving unit; 
 an electrical circuit adapted to generate a stimulating signal; and 
 a first hermetic housing, 
 wherein the first hermetic housing comprises:
 a base part adapted to receive the electrical circuit and/or the at least one receiving unit; 
 a cover part, adapted to cover the base part; and 
 a connecting means, provided between the base part and the cover part, adapted to connect the base part and the cover part and to hermetically seal an interior of the hermetic housing from an exterior of the hermetic housing; 
 
   a second implantable device that is adapted to be implanted into an organ of a patient, and that is connected with the electronics package.   
     
     
         12 . The prosthesis system according to  claim 11 , wherein the second implantable device comprises at least one stimulating electrode configured to stimulate living tissue or cells. 
     
     
         13 . The prosthesis system according  claim 11 , wherein the second implantable device comprises a receiving coil, which is connected to a transmitting coil of the electronics package. 
     
     
         14 . The prosthesis system according to  claim 11 , wherein the prosthesis system comprises an extracorporeal component that includes:
 a first transmitting unit; and   a signal generation unit adapted for generating a signal and applying the signal to the first transmitting unit, wherein the first transmitting unit is adapted for transmitting the signal generated by the signal generation unit to the electronics package.   
     
     
         15 . A method for providing an implantable electronics package suitable to be implanted in a body of an animal or a human patient comprising:
 providing a base part of a hermetic housing adapted to receive an electrical circuit and/or at least one receiving unit;   providing an electrical circuit and/or at least one receiving unit on a bottom part of the base part;   providing, on a surface of the base part, a connecting means;   providing, on the connecting means, a cover part;   connecting the cover part with the base part and hermetically sealing a gap between the cover part and the base part by light induced heating of the connecting means, such that the an interior of the hermetic housing is hermetically sealed from an exterior of the hermetic housing.   
     
     
         16 . The method according to  claim 15 , wherein the connecting means comprises a glass solder paste, and wherein connecting the cover part with the base part comprises laser-soldering of the solder paste. 
     
     
         17 . The method according to  claim 16 , further comprising pre-curing the solder paste onto the base part of the hermetic housing. 
     
     
         18 . The method according to  claim 15 , further comprising controlling a light of a laser to heat an interface area between the cover part and the base part covered with the connecting means, wherein a light intensity of the light is increased and decreased linearly at least around a desired target intensity at a predetermined target point or target area at the interface between the cover part and the base part. 
     
     
         19 . The hermetic housing according to  claim 3 , wherein the ceramic material is a metal-free ceramic material or wherein the base part comprises a plurality of ceramic layers that include layers of low temperature, co-fired ceramic (LTCC). 
     
     
         20 . The hermetic housing according to  claim 2 , wherein the metal-free material includes metal-free glass.