Electronic device fabric integration

Abstract

Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device. This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.

1 . A stretchable and flexible electronic apparatus comprising:
 a waterproof insulating layer attached to a garment;   a plurality of flexible conductive leads attached to the waterproof material; and   an electronics assembly attached to the waterproof material, the plurality of flexible conductive leads mechanically and conductively coupled to a corresponding plurality of electronics contacts on the electronics assembly.   
     
     
         2 . The apparatus of  claim 1 , the electronics assembly including at least one of a flexible electronics assembly, a stretchable electronics assembly, and a rigid electronics assembly. 
     
     
         3 . The apparatus of  claim 1 , further including a conductive adhesive disposed through a plurality of cutouts of a removable mask onto predetermined conductive portions of the electronics assembly, the predetermined conductive portions corresponding to the plurality of flexible conductive leads. 
     
     
         4 . The apparatus of  claim 3 , further including a non-conductive electronics adhesive layer disposed on the electronics assembly by the removable mask. 
     
     
         5 . The apparatus of  claim 3 , wherein the conductive adhesive provides the mechanical and conductive coupling between the plurality of flexible conductive leads and the corresponding plurality of electronics contacts on the electronics assembly. 
     
     
         6 . The apparatus of  claim 3 , wherein the conductive adhesive includes at least one of a conductive epoxy, a conductive glue, and a joint-reinforced conductive paste. 
     
     
         7 . The apparatus of  claim 3 , wherein the conductive adhesive includes a low-temperature solder, the low-temperature solder applied in solid form and subsequently reflowed to provide the mechanical and conductive coupling. 
     
     
         8 . The apparatus of  claim 3 , wherein the conductive adhesive includes a biocompatible liquid metal alloy. 
     
     
         9 . The apparatus of  claim 1 , further including a flexible waterproof upper layer attached to the electronics assembly. 
     
     
         10 . The apparatus of  claim 9 , further including an upper non-conductive adhesive layer disposed between the flexible waterproof upper layer and the electronics assembly. 
     
     
         11 . The apparatus of  claim 1 , further including a lower non-conductive adhesive layer disposed between the plurality of flexible conductive leads and the waterproof insulating layer. 
     
     
         12 . A stretchable and flexible electronic method comprising:
 attaching a waterproof insulating layer to a garment;   attaching a plurality of flexible conductive leads to the waterproof material; and   attaching an electronics assembly to the waterproof material, the plurality of flexible conductive leads mechanically and conductively coupled to a corresponding plurality of electronics contacts on the electronics assembly.   
     
     
         13 . The method of  claim 12 , the electronics assembly including at least one of a flexible electronics assembly, a stretchable electronics assembly, and a rigid electronics assembly. 
     
     
         14 . The method of  claim 12 , further including:
 disposing a removable mask on the electronics assembly;   disposing a conductive adhesive through the plurality of cutouts onto predetermined conductive portions of the electronics assembly, the predetermined conductive portions corresponding to the plurality of flexible conductive leads; and   removing the removable mask from the electronics assembly.   
     
     
         15 . The method of  claim 14 , further including disposing a non-conductive electronics adhesive layer on the electronics assembly. 
     
     
         16 . The method of  claim 15 , wherein:
 the removable mask includes the non-conductive electronics adhesive layer; and   the non-conductive electronics adhesive layer is disposed on the electronics assembly by disposing the removable mask and removing the removable mask from the electronics assembly.   
     
     
         17 . The method of  claim 14 , wherein the conductive adhesive provides the mechanical and conductive coupling between the plurality of flexible conductive leads and the corresponding plurality of electronics contacts on the electronics assembly. 
     
     
         18 . At least one machine-readable storage medium, comprising a plurality of instructions that, responsive to being executed with processor circuitry of a computer-controlled device, cause the computer-controlled device to:
 attach a waterproof insulating layer to a garment;   attach a plurality of flexible conductive leads to the waterproof material; and   attach an electronics assembly to the waterproof material, the plurality of flexible conductive leads mechanically and conductively coupled to a corresponding plurality of electronics contacts on the electronics assembly.   
     
     
         19 . The machine-readable storage medium of  claim 18 , the electronics assembly including at least one of a flexible electronics assembly, a stretchable electronics assembly, and a rigid electronics assembly. 
     
     
         20 . The machine-readable storage medium of  claim 18 , the instructions further causing the computer-controlled device to:
 disposing a removable mask on the electronics assembly;   disposing a conductive adhesive through the plurality of cutouts onto predetermined conductive portions of the electronics assembly, the predetermined conductive portions corresponding to the plurality of flexible conductive leads; and   removing the removable mask from the electronics assembly.   
     
     
         21 . The machine-readable storage medium of  claim 20 , the instructions further causing the computer-controlled device to disposing a non-conductive electronics adhesive layer on the electronics assembly. 
     
     
         22 . The machine-readable storage medium of  claim 21 , wherein:
 the removable mask includes the non-conductive electronics adhesive layer; and   the non-conductive electronics adhesive layer is disposed on the electronics assembly by disposing the removable mask and removing the removable mask from the electronics assembly.   
     
     
         23 . The machine-readable storage medium of  claim 20 , wherein the conductive adhesive includes a low-temperature solder in solid form, the instructions further causing the computer-controlled device to reflowing the low-temperature solder to provide the mechanical and conductive coupling. 
     
     
         24 . The machine-readable storage medium of  claim 20 , wherein the conductive adhesive includes a biocompatible liquid metal alloy. 
     
     
         25 . The machine-readable storage medium of  claim 18 , the instructions further causing the computer-controlled device to attach a flexible waterproof upper layer to the electronics assembly.