Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor
Abstract
A multilayer ceramic capacitor includes: a multilayer structure in which each of a plurality of ceramic dielectric layers and each of a plurality of internal electrode layers are alternately stacked, wherein: (a current value at 10 V/μm when a direct voltage is applied to the plurality of the ceramic dielectric layers at 125 degrees C.)/(a current value at 10 V/μm when a direct voltage is applied to the plurality of the ceramic dielectric layers at 85 degrees C.) is more than 5 and less than 20; and a donor element concentration in the plurality of ceramic dielectric layers is 0.05 atm % or more and 0.3 atm % or less.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A multilayer ceramic capacitor comprising:
a multilayer structure in which each of a plurality of ceramic dielectric layers and each of a plurality of internal electrode layers are alternately stacked, wherein: (a current value at 10 V/μm when a direct voltage is applied to the plurality of the ceramic dielectric layers at 125 degrees C.)/(a current value at 10 V/μm when a direct voltage is applied to the plurality of the ceramic dielectric layers at 85 degrees C.) is more than 5 and less than 20; and a donor element concentration in the plurality of ceramic dielectric layers is 0.05 atm % or more and 0.3 atm % or less.
2 . The multilayer ceramic capacitor as claimed in claim 1 , wherein an average grain diameter of the plurality of ceramic dielectric layers is 80 nm or more and 200 nm or less.
3 . The multilayer ceramic capacitor as claimed in claim 1 , wherein the donor element is at least one of V, Mo, Nb, La, W and Ta.
4 . The multilayer ceramic capacitor as claimed in claim 2 , wherein the donor element is at least one of V, Mo, Nb, La, W and Ta.
5 . The multilayer ceramic capacitor as claimed in claim 1 , wherein a thickness of the plurality of ceramic dielectric layers is 1 μm or less.
6 . The multilayer ceramic capacitor as claimed in claim 1 , where a main component ceramic of the plurality of ceramic dielectric layers has a perovskite structure.
7 . A manufacturing method of a multilayer ceramic capacitor comprising:
forming a green sheet of which a concentration of a donor element with respect to a main component ceramic is 0.05 atm % or more and 0.3 atm % or less; forming a multilayer structure by alternately stacking the green sheet and a conductive paste for forming an internal electrode; and baking the multilayer structure, wherein the multilayer structure is sintered in the baking so that, in the multilayer structure after the baking, (a current value at 10 V/μm when a direct voltage is applied to the plurality of the ceramic dielectric layers at 125 degrees C.)/(a current value at 10 V/μm when a direct voltage is applied to the plurality of the ceramic dielectric layers at 85 degrees C.) becomes more than 5 and less than 20.
8 . The method as claimed in claim 7 , wherein in the forming of the green sheet, a green sheet of a main component ceramic in which the donor element of 0.05 atm % or more and 0.3 atm % or less is solid-solved in advance is formed.Join the waitlist — get patent alerts
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