Method of manufacturing semiconductor device

Abstract

Electrical properties of a semiconductor device are reproducibly and stably measured in a testing step of the semiconductor device. A probe pin includes a first plunger, a second plunger, a cleaning shaft, a first coil spring, and a second coil spring. The cleaning shaft accommodated in the inside of the first plunger is allowed to enter and exit through a tip of a contact of the first plunger by the second coil spring, thereby solder shavings attached to the tip of the contact are removed. The first plunger is electrically coupled to the second plunger by the first coil spring wound on an outer side face of the first plunger and on an outer side face of the second plunger.

1 - 15 . (canceled) 
     
     
         16 . A method of manufacturing a semiconductor device, comprising:
 (a) providing a semiconductor wafer having a main surface divided into a plurality of chip regions, each of the chip regions having a semiconductor integrated circuit; and   (b) bringing a probe pin into contact with each of a plurality of electrode pads provided on the respective chip regions to measure electrical properties of the respective semiconductor integrated circuit,   the probe pin including:   (i) a hollow-structured first plunger that configures an upper part of the probe pin and has a contact that comes into contact with the electrode pad;   (ii) a hollow-structured second plunger that configures a lower part of the probe pin separately from the first plunger, and has a bottom at an end on a side opposite to the first plunger;   (iii) a cleaning shaft that is accommodated inside the first plunger, and partially projects from a tip of the contact;   (iv) a first coil spring that is wound on an outer side face of the first plunger and on an outer side face of the second plunger, and electrically couples the first plunger to the second plunger; and   (v) a second coil spring that is accommodated inside the first plunger and inside the second plunger while being held between the cleaning shaft and the bottom of the second plunger,   wherein when part of the cleaning shaft enters and exits through the tip of the contact, a foreign substance attached to the tip of the contact is removed.   
     
     
         17 . The method according to  claim 16 , wherein when the electrode pad is not in contact with the probe pin, part of the cleaning shaft projects from the tip of the contact. 
     
     
         18 . The method according to  claim 16 , wherein when the electrode pad is not in contact with the probe pin, part of the cleaning shaft projects from the tip of the contact, and
 when the part of the cleaning shaft projecting from the tip of the contact is pushed into the inside of the first plunger from the tip of the contact, the part of the cleaning shaft comes into contact with an inner side face of the contact.   
     
     
         19 . The method according to  claim 16 , wherein when the electrode pad is electrically coupled to the probe pin, the cleaning shaft does not project from the tip of the contact. 
     
     
         20 . The method according to  claim 16 , wherein first spring pressure of the first coil spring is higher than second spring pressure of the second coil spring. 
     
     
         21 . The method according to  claim 16 , wherein the second coil spring is not fixed to the cleaning shaft and to the bottom of the second plunger. 
     
     
         22 . The method according to  claim 16 , wherein a gap of 4 to 6 μm is provided between an inner side face of the first plunger and an outer side face of the cleaning shaft. 
     
     
         23 . The method according to  claim 16 , wherein the first plunger, the second plunger, and the first coil spring each include a conductive material, and the cleaning shaft includes a conductive material or an insulating material. 
     
     
         24 . The method according to  claim 16 , wherein the first plunger includes gold-plated stainless steel or a platinum alloy, and the cleaning shaft includes stainless steel. 
     
     
         25 . The method according to  claim 16 , wherein the contact of the first plunger has a tip with a split shape, and each of apexes of the tip has an acute angle. 
     
     
         26 . The method according to  claim 16 , wherein projections and depressions are alternately and repeatedly provided on an outer side face of the cleaning shaft in a direction in which the probe pin is pushed. 
     
     
         27 . The method according to  claim 16 , wherein abrasive particles are embedded in an outer side face of the cleaning shaft.