Electroless platinum plating solution

Abstract

Provided is an electroless platinum plating solution that can exhibit solution stability without the use of heavy metal ions or thiol compounds and can prevent the generation of ammonia gas. The electroless platinum plating solution is characterized by comprising a water-soluble platinum compound, and one or more reducing agents selected from the group consisting of formalin, glucose, formic acid and formates. The water-soluble platinum compound is preferably one or more water-soluble platinum compounds selected from the group consisting of platinous chloride (II), hydrogen tetrachloroplatinate (II), tetrachloroplatinate (II), platinic chloride (IV), hydrogen hexachloroplatinate (IV), hexachloroplatinate (IV), hydrogen hexahydroxoplatinate (IV), hexahydroxoplatinate (IV) and dichlorotetraammineplatinum (II). The electroless platinum plating solution preferably comprises an organic acid.

1 . An electroless platinum plating solution comprising a water-soluble platinum compound, and one or more reducing agents selected from the group consisting of formalin, glucose, formic acid and formates. 
     
     
         2 . The electroless platinum plating solution according to  claim 1 , wherein the water-soluble platinum compound is one or more water-soluble platinum compounds selected from the group consisting of platinous chloride (II), hydrogen tetrachloroplatinate (II), tetrachloroplatinate (II), platinic chloride (IV), hydrogen hexachloroplatinate (IV), hexachloroplatinate (IV), hydrogen hexahydroxoplatinate (IV), hexahydroxoplatinate (IV) and dichlorotetrammineplatinum (II). 
     
     
         3 . The electroless platinum plating solution according to  claim 1 , comprising an organic acid as a complexing agent. 
     
     
         4 . The electroless platinum plating solution according to  claim 3 , wherein the organic acid is one or more compounds selected from aliphatic hydroxy acids having a molecular weight of 90 to 500. 
     
     
         5 . The electroless platinum plating solution according to  claim 2 , comprising an organic acid as a complexing agent. 
     
     
         6 . The electroless platinum plating solution according to  claim 5 , wherein the organic acid is one or more compounds selected from aliphatic hydroxy acids having a molecular weight of 90 to 500.